參數(shù)資料
型號(hào): CMH02A
廠商: Toshiba Corporation
英文描述: Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.7 to 11.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD
中文描述: 開關(guān)電源的應(yīng)用
文件頁(yè)數(shù): 1/5頁(yè)
文件大?。?/td> 180K
代理商: CMH02A
CMH02A
2006-11-08
1
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH02A
Switching Mode Power Supply Applications
Repetitive peak reverse voltage: V
RRM
= 400 V
Average forward current: I
F (AV)
= 3.0 A
Low forward voltage: V
FM
=1.8 V (Max.)
Very fast reverse recovery time: trr =35ns (Max.)
Suitable for compact assembly due to small surface-mount package
“M
FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
V
RRM
I
F (AV)
400
V
Average forward current
3.0 (Note 1)
A
Peak one cycle surge forward current
(non-repetitive)
I
FSM
30 (50 Hz)
A
Junction temperature
T
j
T
stg
40~150
40~150
°C
Storage temperature range
°C
Note 1: T
77°C
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Device mounted on a ceramic board
board size: 50 mm
×
50 mm
soldering land: 2 mm
×
2 mm
board thickness:0.64t
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
FM (1)
V
FM (2)
V
FM (3)
I
RRM
t
rr
t
fr
I
FM
=
0.1 A (pulse test)
I
FM
=
1.0 A (pulse test)
I
FM
=
3.0 A (pulse test)
V
RRM
=
400 V (pulse test)
I
F
=
1 A, di/dt =
30 A/
μ
s
I
F
=
1.0 A
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
0.78
1.1
Peak forward voltage
1.4
1.8
V
Peak repetitive reverse current
10
μ
A
Reverse recovery time
35
ns
ns
Forward recovery time
100
60
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
135
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
210
°C/W
Thermal resistance
(junction to lead)
R
th (j-
)
16
°C/W
Unit: mm
JEDEC
JEITA
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
相關(guān)PDF資料
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