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參數(shù)資料
| 型號： | CMH01 |
| 廠商： | Toshiba Corporation |
| 英文描述： | Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.4 to 10.8; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD |
| 中文描述： | 開關(guān)電源的應(yīng)用 |
| 文件頁數(shù)： | 1/5頁 |
| 文件大?。?/td> | 201K |
| 代理商： | CMH01 |
CMH01
2006-11-08
1
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH01
Switching Mode Power Supply Applications
Repetitive peak reverse voltage: V
RRM
= 200 V
Average forward current: I
F (AV)
= 3.0 A
Low forward voltage: V
FM
=0.98 V (Max)
Very Fast Reverse-Recovery Time: trr =35ns(Max)
Suitable for compact assembly due to small surface-mount package
“M
FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
V
RRM
I
F (AV)
200
V
Average forward current
3.0 (Note 1)
A
Peak one cycle surge forward current
(non-repetitive)
I
FSM
40 (50 Hz)
A
Junction temperature
T
j
T
stg
40~150
40~150
°C
Storage temperature range
°C
Note 1: T
＝
96°C
Note2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Device mounted on a ceramic board
board size: 50 mm
×
50 mm
soldering land: 2 mm
×
2 mm
glass-epoxy board thickness:0.64t
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
FM (1)
V
FM (2)
V
FM (3)
I
RRM
t
rr
t
fr
I
FM
=
0.1 A (pulse test)
I
FM
=
1.0 A (pulse test)
I
FM
=
3.0 A (pulse test)
V
RRM
=
200 V (pulse test)
I
F
=
1 A, di/dt =
30 A/
μ
s
I
F
=
1 A
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
0.64
0.80
Peak forward voltage
0.90
0.98
V
Peak repetitive reverse current
10
μ
A
Reverse recovery time
35
ns
ns
Forward recovery time
100
60
pF
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
135
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
210
°C/W
Thermal resistance
(junction to lead)
R
th (j-
)
16
°C/W
Unit: mm
JEDEC
―
JEITA
―
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
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| CMH02A | Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.7 to 11.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD |
| CMH05A | Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.9 to 11.3; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD |
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| CMH04 | Zener Diode; Application: General; Pd (mW): 400; Vz (V): 11.4 to 11.9; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD |
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參數(shù)描述 |
|---|---|
| CMH01(T2L,HITJ,X) | 制造商:Toshiba America Electronic Components 功能描述: |
| CMH01(T2L,TEMQ) | 制造商:Toshiba America Electronic Components 功能描述:Diode 200V 3A HED 35ns M-FLAT |
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| CMH01(TE12L,Q,M) | 功能描述:整流器 200V Vrrm 3.0A IF 0.98 VFM 40A IFSM RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復(fù)時間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
| CM-H010 | 制造商:Southco 功能描述: |
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