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參數(shù)資料
| 型號： | CMC01 |
| 廠商： | Toshiba Corporation |
| 英文描述： | SILICON DIFFUSED TYPE For Strobe Discharge Circuit |
| 中文描述： | 硅擴(kuò)散類型頻閃放電電路 |
| 文件頁數(shù)： | 1/5頁 |
| 文件大?。?/td> | 200K |
| 代理商： | CMC01 |
CMC01
2006-11-06
1
TOSHIBA RECTIFIER SILICON DIFFUSED TYPE
CMC01
For Strobe Discharge Circuit
Repetitive peak reverse voltage
: VRRM = 400 V
Average forward current
:
I
F (AV)
= 1.0 A
Repetitive peak forward current
:
I
FRM
= 150 A (Refer to the Note 2)
Small surface-mount package
“M
FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
V
RRM
I
F (AV)
400
V
Average forward current (Note 1)
1.0(Ta=47°C)
A
Peak one cycle surge forward current
(non-repetitive)
I
FSM
30 (50 Hz)
A
Repetitive peak forward current
(Note 2)
I
FRM
150
A
Junction temperature
T
j
-40
～
150
°C
Storage temperature range
T
stg
-40
～
150
°C
Note 1: Device mounted on a glass-epoxy board
board size: 50 mm
×
50 mm
soldering land: 6 mm
×
6 mm
glass-epoxy board thickness 1.6t
Note 3: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Peak forward voltage
V
FM
I
FM
= 1.0 A
（
Pulse test
）
0.86
1.0
V
Repetitive peak reverse current
I
RRM
V
RRM
= 400 V
（
Pulse test
）
10
μ
A
Device mounted on a ceramic board
Board size: 50 mm
×
50 mm
Soldering land: 2 mm
×
2 mm
Ceramic board thickness: 0.64t
60
Device mounted on a glass-epoxy
board
Board size: 50 mm
×
50 mm
Soldering land: 6 mm
×
6 mm
glass-epoxy board thickness: 1.6t
110
R
th (j-a)
Device mounted on a glass-epoxy
board
Board size: 50 mm
×
50 mm
Soldering land: 2.1 mm
×
1.4 mm
glass-epoxy board thickness: 1.6t
180
°C/W
Thermal resistance
R
th (j-
)
―
16
°C/W
Unit: mm
JEDEC
―
JEITA
―
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
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