參數(shù)資料
型號: CLP200M
廠商: 意法半導(dǎo)體
英文描述: OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE
中文描述: 過壓和過流保護(hù)的電信線路保護(hù)
文件頁數(shù): 18/21頁
文件大小: 232K
代理商: CLP200M
Fig2 :
Mountingon epoxyFR4 headdissipationby extendingthe areaof the copperlayer
Fig3 :
Mountingon epoxyFR4 by using copper-filledthroughholes for heat transfer
FR4 board
Copper foil
FR4board
Copperfoil
heattransfer
heatsink
SUBSTRATESANDMOUNTINGINFORMATION
The use of epoxyFR4 boardsis quite common for
surface mounting techniques, however, their poor
thermalconductioncompromises the
outstandingthermalperformanceof the PowerSO-
10. Some methodsto overcomethis limitation are
discussedbelow.
One possibility to improve the thermal conduction
is the use of large heat spreader areasat thecop-
perlayerof the PCboard.This leadsto areduction
of thermal resistance to 35
°
C for 6 cm
2
of the
boardheatsink(seefig. 2).
Use of copper-filledthroughholes on conventional
FR4 techniqueswill increasethe metallizationand
otherwise
decrease thermal resistance accordingly. Using
a configurationwith 16holesunderthespreaderof
thepackagewith a pitchof 1.8 mm anda diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12
°
C/W (see fig. 3).
Besidethe thermaladvantage,thissolutionallows
multi-layer boards to be used. However, a draw-
back of this traditional material prevent its use in
veryhighpower,highcurrentcircuits.For instance,
it is not advisable to surface mount devices with
currents greater than 10 A on FR4 boards. A
PowerMosfetor Schottkydiodein asurfacemount
power package can handle up to around 50 A if
bettersubstratesare used.
CLP200M
18/21
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