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參數(shù)資料
| 型號： | CLP200M |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE |
| 中文描述： | 過壓和過流保護(hù)的電信線路保護(hù) |
| 文件頁數(shù)： | 17/21頁 |
| 文件大小： | 232K |
| 代理商： | CLP200M |
Fig1 :
Typicalreflowsoldering heat profile
Time (s)
Temperature ( C)
0
40
80
120
160
200
240
280
320
360
0
50
100
150
200
250
o
215 C
Soldering
Preheating
Cooling
245 C
Epoxy FR4
board
Metal-backed
board
SOLDERINGRECOMMENDATION
The soldering process causes considerable ther-
mal stress to a semiconductor component. This
has to be minimized to assure a reliable and ex-
tended lifetime of the device. The PowerSO-10
TM
package can be exposed to a maximum tempera-
ture of 260
°
C for 10 seconds. However a proper
soldering of the package could be done at 215
°
C
for 3 seconds. Any solder temperature profile
shouldbe within these limits. As reflowtechniques
are most common in surface mounting, typical
heating profiles are given in Figure 1,either for
mounting on FR4 or on metal-backed boards. For
each particular board, the appropriate heat profile
has to be adjusted experimentally. The present
proposalis justastartingpoint.In anycase,the fol-
lowingprecautionshaveto be considered:
- alwayspreheat thedevice
- peaktemperatureshould be at least30
°
C
higherthan themeltingpointof the solder
alloychosen
- thermalcapacityof the basesubstrate
Voids pose a difficult reliability problem for large
surfacemountdevices.Suchvoidsunderthepack-
age result in poor thermal contact and the high
thermal resistance leads to component failures.
The PowerSO-10 is designed from scratch to be
solely a surfacemount package, hence symmetry
in the x- and y-axis gives the package excellent
weight balance.Moreover,the PowerSO-10offers
the unique possibility to control easily the flatness
and quality of the soldering process. Both the top
and the bottomsolderededges of the packageare
accessible for visual inspection (soldering menis-
cus).
Coplanarity between the substrate and the pack-
agecan be easilyverified.The qualityof thesolder
joints is very important for two reasons : (I) poor
quality solder jointsresult directly in poor reliability
and (II) solder thickness affects the thermalresis-
tance significantly. Thus a tight control of this pa-
rameter results in thermally efficient and reliable
solderjoints.
CLP200M
17/21
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| CLP30-200B1RL | OVERVOLTAGE & OVERCURRENT PROTECTION FOR TELECOM LINE |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CLP200M_03 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE |
| CLP200M-TR | 功能描述:TVS二極管陣列 Telecom Protection RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| CLP-201 | 功能描述:散熱片 STANDARD CLIP 14.99X13.59X3.18 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR |
| CLP-202 | 制造商:Aavid Thermalloy 功能描述:MOUNTING CLIPS 制造商:Aavid Thermalloy 功能描述:- Bulk 制造商:Aavid Thermalloy 功能描述:Aavid Internal P/N:033123 |
| CLP-203 | 制造商:Aavid Thermalloy 功能描述:- Bulk 制造商:Aavid Thermalloy 功能描述:MOUNTING CLIPS |
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