參數(shù)資料
型號: BX80552661
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775
封裝: FLIP CHIP, LGA-775
文件頁數(shù): 32/108頁
文件大?。?/td> 3283K
代理商: BX80552661
Datasheet
3
Contents
Introduction .............................................................................................................................13
Terminology ........................................................................................................................ 14
Processor Packaging Terminology ........................................................................ 14
Electrical Specifications .....................................................................................................17
Power and Ground Lands ................................................................................................... 17
VCC Decoupling .....................................................................................................17
VTT Decoupling ......................................................................................................17
Voltage Identification .......................................................................................................... 18
Reserved, Unused, and TESTHI Signals ........................................................................... 20
DC Voltage and Current Specification ................................................................... 22
VCC Overshoot.......................................................................................................26
FSB Signal Groups ................................................................................................ 27
GTL+ Asynchronous Signals ................................................................................. 29
Processor DC Specifications ................................................................................. 30
GTL+ Front Side Bus Specifications ...................................................... 33
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking .................................. 34
BCLK[1:0] Specifications ....................................................................................... 37
Package Mechanical Specifications ..............................................................................39
Land Listing and Signal Descriptions...........................................................................47
Alphabetical Signals Reference .......................................................................................... 70
Thermal Specifications and Design Considerations ..............................................79
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