Datasheet
99
Balanced Technology Extended (BTX) Boxed Processor Specifications
8
Balanced Technology Extended
(BTX) Boxed Processor
Specifications
The Intel Pentium 4 processors will be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from largely standard components. The
boxed Intel Pentium 4 processor will be supplied with a cooling solution known as the Thermal
Module Assembly (TMA). Each processor will be supplied with one of the two available types of
TMAs – Type I or Type II. This chapter documents motherboard and system requirements for both
the TMAs that will be supplied with the boxed Pentium 4 processor in the 775-land package. This
chapter is particularly important for OEMs that manufacture motherboards for system integrators.
Figure 8-1 shows a mechanical representation of a boxed Pentium 4 processor in the 775-land
package with a Type I TMA.
Figure 8-2 illustrates a mechanical representation of a boxed Pentium
4 processor in the 775-land package with Type II TMA.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in
brackets].
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designers’ responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel Pentium D
Processor, Intel Pentium Processor Extreme Edition, and Intel Pentium 4 Processor Thermal
and Mechanical Design Guidelines for further guidance.
NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but the basic shape
and size will remain the same.
Figure 8-1. Mechanical Representation of the Boxed Processor with a Type I TMA