- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄256080 > BX80532KE3066E (INTEL CORP) 3060 MHz, MICROPROCESSOR, XMA PDF資料下載
參數(shù)資料
| 型號(hào)： | BX80532KE3066E |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 3060 MHz, MICROPROCESSOR, XMA |
| 文件頁(yè)數(shù)： | 32/102頁(yè) |
| 文件大?。?/td> | 1464K |
| 代理商： | BX80532KE3066E |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)當(dāng)前第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
35
Figure 13 details the flatness and tilt specifications for the IHS of the Intel Xeon processor with
533 MHz Front Side Bus, respectively. Tilt is measured with the reference datum set to the bottom
of the processor interposer.
3.2
Processor Package Load Specifications
Table 15 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heat sink assembly, mechanical stress testing, or
standard drop and shipping conditions. The heat sink attach solutions must not induce continuous
stress onto the processor with the exception of a uniform load to maintain the heat sink-to-
processor thermal interface. It is not recommended to use any portion of the processor interposer as
a mechanical reference or load bearing surface for thermal solutions.
NOTES:
1. This specification applies to a uniform compressed load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. These parameters are based on design characterization and not tested.
4. Dynamic loading specifications are defined assuming a maximum duration of 11ms.
5. The heatsink weight is assumed to be one pound. Shock input to the system during shock testing is assumed
to be 50 G’s. AF is the amplification factor.
Figure 13.
IHS Flatness and Tilt Drawing
0.080
Table 15. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Static
50
lbf
1, 2, 3
Dynamic
50 + 1 lb * 50G input * 1.8 (AF)
= 140
lbf
1, 2, 4, 5
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BX80532RC2400B | 32-BIT, 2400 MHz, MICROPROCESSOR |
| BU-61559D1-230W | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
| BU-61559D1-230 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
| BU-61559D1-260Y | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
| BU-61559D1-340Q | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP78 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80532KE3066EU | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 3.06GHZ - Boxed Product (Development Kits) |
| BX80532KE3200F | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 3.2GHZ - Boxed Product (Development Kits) |
| BX80532PC1800D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 1.8GHZ - Boxed Product (Development Kits) |
| BX80532PC2000D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 2GHZ - Boxed Product (Development Kits) 制造商:Intel 功能描述:P4 Socket 478 2.0GHz with fan |
| BX80532PC2200D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。