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參數(shù)資料
| 型號(hào)： | BX80523R266000 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, MICROPROCESSOR, XMA |
| 封裝： | SINGLE EDGE PROCESSOR PACKAGE |
| 文件頁(yè)數(shù)： | 14/130頁(yè) |
| 文件大?。?/td> | 2654K |
| 代理商： | BX80523R266000 |
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110
Datasheet
Intel Celeron Processor up to 1.10 GHz
6.0
Boxed Processor Specifications
The Celeron processor is also offered as an Intel boxed processor in the FC-PGA/FC-PGA2,
PPGA, and S.E.P. Packages. Intel boxed processors are intended for system integrators who build
systems from motherboards and standard components. The boxed Celeron processor in the S.E.P.
Package is supplied with an attached fan heatsink. The boxed Celeron processors in FC-PGA/
FC-PGA2 and PPGA packages are supplied with unattached fan heatsinks.
This section documents motherboard and system requirements for the fan heatsink that is supplied
with the boxed Intel Celeron processor. This section is particularly important for OEMs that
manufacture motherboards for system integrators. Unless otherwise noted, all figures in this
section are dimensioned in inches.
Note:
Drawings in this section reflect only the specifications of the Intel boxed processor product. These
dimensions should not be used as a generic keepout zone for all heatsinks. It is the system
designer’s responsibility to consider their proprietary solution when designing to the required
keepout zone on their system platform and chassis. Refer to the package specific Thermal /
Mechanical Solution Functional Specifications for further guidance. Contact your local Intel Sales
Representative for these documents.
6.1
Mechanical Specifications for the Boxed Intel Celeron
Processor
6.1.1
Mechanical Specifications for the S.E.P. Package
This section documents the mechanical specifications of the boxed Celeron processor fan heatsink
in the S.E.P. Package. The boxed processor in the S.E.P. Package ships with an attached fan
heatsink. Figure 31 shows a mechanical representation of the boxed Intel Celeron processor in a
S.E.P. Package in the retention mechanism, which is not shipped with the boxed Intel Celeron
processor.
The space requirements and dimensions for the boxed processor in the S.E.P. Package are shown in
Figure 32 and Figure 33. Also, a conceptual attachment interface to low profile retention
mechanism is shown in Figure 38.
Note:
processor’s active fan heatsink. This does not reflect the worst-case dimensions that may exist with
other third party passive or active fan heatsinks.
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