參數(shù)資料
型號： BU-65863F3-220
廠商： DATA DEVICE CORP
元件分類： 微控制器/微處理器
英文描述： 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP80
封裝： 0.880 INCH, CERAMIC, QFP-80
文件頁數(shù)： 71/75頁
文件大?。?/td> 532K
代理商： BU-65863F3-220
73
Data Device Corporation
www.ddc-web.com
BU-65743/65843/65863/65864
D-06/04-0
ORDERING INFORMATION FOR PCI MICRO-ACE-TE
BU-65863B8-E02
Test Criteria:
2 = MIL-STD-1760 Amplitude Compliant
Process Requirements:
0 = Standard DDC practices, no Burn-In
Temperature Range/Data Requirements:
E = -40°C to +100°C
Voltage/Transceiver Option:
3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B)
8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B)
Package Type:
B = 324-ball BGA Package
Logic / RAM Voltage
3 = 3.3 Volt Logic/RAM
4 = 3.3 Volt Logic/5V RAM
Product Type: (See Product Matrix on Page 74)
BU-6584 = BC/RT/MT with 4K x 16 RAM
BU-6586 = BC/RT/MT with 64K x 17 RAM
ACCESSORIES:
BU-64863B8-600
MICRO-ACE-TE (324 Ball BGA) Mechanical Sample, with "daisy chain" connections of alternating balls,
for use in environmental (mechanical / thermal) integrity testing.
TABLE 1
1015 (note 1), 1030 (note 2)
BURN-IN
Notes:
1. For Process Requirement "B*" (refer to ordering information), devices may be non-compliant with MIL-
STD-883, Test Method 1015, Paragraph 3.2. Contact factory for details.
2. When applicable.
3000g
2001
CONSTANT ACCELERATION
C
1010
TEMPERATURE CYCLE
A and C
1014
SEAL
—
2009, 2010, 2017, and 2032
INSPECTION
CONDITION(S)
METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
FOR HYBRID AND MONOLITHIC HERMETIC PRODUCTS
B
1010
TEMPERATURE CYCLE
—
2010, 2017, and 2032
INSPECTION
CONDITION(S)
METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
FOR BGA PRODUCTS
相關(guān)PDF資料
PDF描述
BU-65843B3-E02 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA324
BU-65863B8-E02 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA324
BU-65843B8-E02 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA324
BU1003 POWER TRANSISTOR
BU2003 POWER TRANSISTOR
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