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參數(shù)資料
| 型號： | BGY925 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | UHF amplifier module(UHF放大器模塊) |
| 中文描述： | 920 MHz - 960 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | PLASTIC, SOT365A, 4 PIN |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 88K |
| 代理商： | BGY925 |
2000 Feb 02
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY925
List of components (See Figs
14
and
15
)
Note
1.
The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (
ε
r
= 4.5); thickness = 1 mm.
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C2
C3, C4
L1, L2
R1, R2
Z
1
, Z
2
electrolytic capacitor
multilayer ceramic chip capacitor
Grade 4S2 Ferroxcube bead
metal film resistor
stripline; note 1
10
μ
F; 35 V
100 nF; 50 V
4330 030 36300
2322 195 13109
10
; 0.4 W
50
MOUNTING RECOMMENDATIONS
To ensure a good thermal contact and to prevent
mechanical stress when bolted down, the flatness of the
mounting base is designed to be typically better than
0.1 mm. The mounting area of the heatsink should be flat
and free from burrs and loose particles. The heatsink
should be rigid and not prone to bowing under thermal
cycling conditions. The thickness of a solid heatsink
should be not less than 5 mm to ensure a rigid assembly.
A thin, even layer of thermal compound should be applied
between the mounting base and the heatsink to achieve
the best possible thermal contact resistance. Excessive
use of thermal compound will result in an increase in
thermal resistance and possible bowing of the
mounting-base; too little will also result in poor thermal
conduction.
The module should be mounted to the heatsink using
3 mm bolts with flat washers. The bolts should first be
tightened to “finger tight” and then further tightened in
alternating steps to a maximum torque of 0.4 to 0.6 Nm.
Once mounted on the heatsink, the module leads can be
soldered to the printed-circuit board. A soldering iron may
be used up to a temperature of 250
°
C for a maximum of
10 seconds at a distance of 2 mm from the plastic cap.
ESD precautions must be taken to protect the device from
electrostatic damage.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BGY925,127 | 制造商:NXP Semiconductors 功能描述: |
| BGY925/5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
| BGY925/5,127 | 功能描述:射頻放大器 RAIL TNS-RFPR RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| BGYD450K | 制造商:PCTEL 功能描述:ANTENNA UNIT |
| BGYD806K | 制造商:PCTEL 功能描述:ANTENNA UNIT |
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