參數(shù)資料
型號(hào): BGF802-20
廠商: NXP SEMICONDUCTORS
元件分類: 衰減器
英文描述: CDMA800 power module
中文描述: 869 MHz - 894 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
封裝: PLASTIC, SOT-365C, 3 PIN
文件頁(yè)數(shù): 12/12頁(yè)
文件大?。?/td> 95K
代理商: BGF802-20
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit
http://www.semiconductors.philips.com
.
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com
.
Fax:
+31 40 27 24825
Printed in The Netherlands
613524/04/pp
12
Date of release:
2003 Feb 24
Document order number:
9397 750 10698
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BGF802-20,127 功能描述:射頻放大器 LDMOS MOD RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
BGF8158Z 功能描述:MMIC 制造商:nxp usa inc. 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:5,000
BGF844 功能描述:射頻放大器 LDMOS MOD RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
BGF844,127 功能描述:射頻放大器 LDMOS MOD RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
BGF844,135 制造商:NXP Semiconductors 功能描述: