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參數(shù)資料
| 型號(hào)： | BGF 110 E6327 |
| 廠商： | Infineon Technologies |
| 文件頁數(shù)： | 4/8頁 |
| 文件大小： | 0K |
| 描述： | IC MEMORY CARD PROTECT S-WLP-24 |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 類型： | 濾波器，HSMMC，帶 ESD 保護(hù) |
| 應(yīng)用： | HSMMC（高速多媒體卡） |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-UFBGA，WLCSP |
| 供應(yīng)商設(shè)備封裝： | S-WLP-24 |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | BGF110E6327XT SP000210963 |
Data Sheet
4
V2.2, 2007-07-04
BGF110
SD Card Interface ESD Protection
Description
The BGF110 is an ESD protection for the SD Card interface using a green wafer level package. External pins are
protected up to 15 kV contact discharge according to IEC61000-4-2. A RF filter functionality provides very good
RF and EMI suppression on the digital lines with very low cross talk. Sensitivity of the line capacitance on the bias
voltage is very low. The wafer level package has a 400
m solder ball pitch and 250 m ball diameter (before ball
attach).
Feature
ESD protection for SD Card interface
Integrated ESD protection up to 15 kV contact discharge
Very good EMI filtering with very low cross talk
Green wafer level package with SnAgSu solder balls
400
m solder ball pitch
Type
Package
Marking
Chip
BGF110
WLP-24-2
BGF110
N0720
Table 1
Maximum Ratings
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Voltage at all pins to GND
V
P
-14
14
V
Operating temperature range
T
OP
-40
+85
°C
Storage temperature range
T
STG
-65
+150
°C
Maximum current at all pins
I
max
1131)
1) Can be applied for 24 hours if thermal power dissipation into PCB is considered properly
mA
Electrostatic discharge according to IEC61000-4-2 (contact discharge)
Ext. IOs: A4, A5, B4, B5, C4, C5, D4, D5, E4, E5
V
E
-15
15
kV
Int. IOs: A1, A2, B1, B2, C1, C2, C3, D1, D2, E1, E2
V
I
-2
2
kV
WLP-24-2
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