參數(shù)資料
型號(hào): AUIRF1324WL
元件分類(lèi): JFETs
英文描述: 240 A, 24 V, 0.0013 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA
封裝: ROHS COMPLIANT, PLASTIC, TO-262 WIDELEAD, 3 PIN
文件頁(yè)數(shù): 1/11頁(yè)
文件大?。?/td> 238K
代理商: AUIRF1324WL
05/12/11
www.irf.com
1
HEXFET Power MOSFET
AUIRF1324WL
GD
S
Gate
Drain
Source
Description
Specifically design for automotive applications this Widelead TO-
262 package part has the advantage of having over 50% lower
lead resistance and delivering over 20% lower Rds(on) when
compared with a traditional TO-262 package housing the same
silicon die. This greatly helps in reducing condition losses, achieving
higher current levels or enabling a system to run cooler and have
improved efficiency. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make this
design an extremely efficient and reliable device for use in
Automotive and other applications.
Features
l Advanced Process Technology
l Ultra Low On-Resistance
l 50% Lower Lead Resistance
l 175°C Operating Temperature
l Fast Switching
l Repetitive Avalanche Allowed up to Tjmax
l Lead-Free, RoHS Compliant
l Automotive Qualified *
HEXFET is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
AUTOMOTIVE GRADE
PD - 97676
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only; and functional operation of the device at these or any other condition beyond those
indicated in the specifications is not implied.
Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
S
D
G
V(BR)DSS
24V
RDS(on) typ.
1.16mΩ
max.
1.30mΩ
ID (Silicon Limited)
382A c
ID (Package Limited)
240A
TO-262 WideLead
G
D
S
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
IDM
Pulsed Drain Current
d
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS (Thermally limited)
Single Pulse Avalanche Energy e
mJ
IAR
Avalanche Currentd
A
EAR
Repetitive Avalanche Energy
d
mJ
dv/dt
Peak Diode Recovery f
V/ns
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case j
–––
0.50
A
°C
°C/W
300 (1.6mm from case)
530
See Fig. 14, 15, 22a, 22b,
Max.
382
270
1530
240
300
1.3
-55 to + 175
± 20
2.0
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