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參數(shù)資料
| 型號： | AU5790D14-T |
| 英文描述： | LAN TRANSCEIVER|SINGLE|SOP|14PIN|PLASTIC |
| 中文描述： | 網(wǎng)絡收發(fā)器|單|?？苵 14PIN |塑料 |
| 文件頁數(shù)： | 14/19頁 |
| 文件大小： | 165K |
| 代理商： | AU5790D14-T |
Philips Semiconductors
Preliminary specification
AU5790
Single wire CAN transceiver
14
Table 3 shows the maximum power dissipation of an AU5790 without tripping the thermal overload protection, for specified combinations of
package, board configuration, and ambient temperature.
Table 3. Maximum power dissipation
Θ
JA
P
tot
Power Dissipation Max.
Additional Foil Area for
Heat Dissipation
Thermal Resistance
T
a
= 85
°
C
mW
T
a
= 125
°
C
mW
Board Type
K/W
SO-8 on High
Conductance Board
Normal traces
103
631
243
225 Sq. mm of copper
foil attached to pin 8.
82
793
305
SO-8 on Low
Conductance Board
Normal traces
163
399
153
225 Sq. mm of copper
attached to pin 8.
119
546
210
SO-8 on Very Low
Conductance Board
Normal traces
194
335
129
225 Sq. mm of copper
attached to pin 8.
135
481
185
SO-14 on High
Conductance Board
Normal traces
63
1032
397
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
50
1300
500
SO-14 on Low
Conductance Board
Normal traces
103
631
243
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
70
929
357
SO-14 on Very Low
Conductance Board
Normal traces
126
516
198
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
82
793
305
NOTES:
1. The High Conductance board is based on modeling done to EIA/JEDEC Standard JESD51-7. The board emulated contains two one ounce
thick copper ground planes, and top surface copper conductor traces of two ounce (0.071 mm thickness of copper).
2. The Low Conductance board is based on modeling done to EIA/JEDEC Standard EIA/JESD51-3. The board does not contain any ground
planes, and the top surface copper conductor traces of two ounce (0.071 mm thickness of copper).
3. The Very Low Conductance board is based on the EIA/JESD51-3, however the thickness of the surface conductors has been reduced to
0.035 mm (also referred to as 1.0 Ounce copper).
4. The above mentioned JEDEC specifications are available from:
http://www.jedec.org/
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