參數(shù)資料
型號: ATSAM3SD8CA-CU
廠商: Atmel
文件頁數(shù): 57/57頁
文件大?。?/td> 0K
描述: IC MCU 2X256KB CORTEX-M3 100-QFN
標(biāo)準(zhǔn)包裝: 260
系列: SAM3S
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 64MHz
連通性: EBI/EMI,I²C,IrDA,MMC,SPI,SSC,UART/USART,USB
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,I²S,POR,PWM,WDT
輸入/輸出數(shù): 79
程序存儲器容量: 512KB(512K x 8)
程序存儲器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.62 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b,D/A 2x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: *
包裝: *
9
11090BS–ATARM–22-Oct-13
SAM3S8/SD8 Summary
4.
Package and Pinout
SAM3S8/SD8 devices are pin-to-pin compatible with AT91SAM7S legacy products for 64-pin
version. Furthermore, SAM3S8/SD8 products have new functionalities referenced in italic in
Table 4-1, Table 4-3.
4.1
SAM3S8C/8DC Package and Pinout
4.1.1
100-Lead LQFP Package Outline
Figure 4-1.
Orientation of the 100-lead LQFP Package
4.1.2
100-ball TFBGA Package Outline
The 100-Ball TFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its
dimensions are 9 x 9 x 1.1 mm. Figure 4-2 shows the orientation of the 100-ball TFBGA
Package.
Figure 4-2.
Orientation of the 100-ball TFBGA Package
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100
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