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參數(shù)資料
| 型號(hào)： | AS80196CB |
| 廠商： | Intel Corp. |
| 英文描述： | ADVANCED 16-BIT CHMOS MICROCONTROLLER WITH INTEGRATED CAN 2.0 |
| 中文描述： | 先進(jìn)的16位單片機(jī)CHMOS集成CAN 2.0 |
| 文件頁數(shù)： | 3/33頁 |
| 文件大?。?/td> | 453K |
| 代理商： | AS80196CB |
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87C196CA/87C196CB
PROCESS INFORMATION
These devices are manufactured on P629.5, a
CHMOS III-E process. Additional process and reli-
ability information is available in Intel’s Components
Quality and Reliability Handbook, Order Number
210997.
All thermal impedance data is approximate for static
air conditions at 1.0W of power dissipation. Values
will change depending on operation conditions and
application. See the Intel Packaging Handbook (or-
der number 240800) for a description of Intel’s ther-
mal impedance test methodology.
272405–2
Figure 2. The 87C196CA/CB Familiy Nomenclature
Thermal Characteristics
Device and Package
i
JA
i
JC
AN87C196CB
(84-Lead PLCC Package)
35.0
§
C/W
11.0
§
C/W
AN87C196CA
(68-Lead PLCC Package)
36.5
§
C/W
10.0
§
C/W
NOTES:
1.
i
JA
e
Thermal resistance between junction and the surrounding environment (ambient) measurements are taken 1 ft.
away from case in air flow environment.
i
JC
e
Thermal resistance between junction and package face (case).
2. All values of
i
JA
and
i
JC
may fluctuate depending on the environment (with or without airflow, and how much airflow)
and device power dissipation at temperature of operation. Typical variations are
g
2
§
C/W.
3. Values listed are at a maximum power dissipation of 1.0W.
3
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