參數(shù)資料
型號(hào): AS7C33512PFS32A-225TQC
廠商: ALLIANCE SEMICONDUCTOR CORP
元件分類: SRAM
英文描述: 512K X 32 STANDARD SRAM, 6.9 ns, PQFP100
封裝: 14 X 20 MM, TQFP-100
文件頁數(shù): 11/21頁
文件大?。?/td> 463K
代理商: AS7C33512PFS32A-225TQC
12/2/02, v. 0.9.8 Advance Info
Alliance Semiconductor
19 of 21
AS7C33512PFS32A
AS7C33512PFS36A
AC test conditions
Notes
1
For test conditions, see “AC test conditions”, Figures A, B, and C.
2
This parameter is measured with output load condition in Figure C.
3
This parameter is sampled but not 100% tested.
4tHZOE is less than tLZOE, and tHZC is less than tLZC at any given temperature and voltage.
5tCH is measured as high if above VIH, and tCL is measured as low if below VIL.
6
This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must meet
the setup and hold times for all rising edges of CLK when chip is enabled.
7
Write refers to GWE, BWE, and BW[a:d].
8
Chip select refers to CE0, CE1, and CE2.
Z0 = 50
DOUT
50
Figure B: Output load (A)
30 pF*
Figure A: Input waveform
10%
90%
GND
90%
10%
+3.0V
Output load: For tLZC, tLZOE, tHZOE, tHZC, see Figure C. For all others, see Figure B.
Input pulse level: GND to 3V. See Figure A.
Input rise and fall time (measured at 0.3V and 2.7V): 2 ns. See Figure A.
Input and output timing reference levels: 1.5V.
VL = 1.5V
for 3.3V I/O;
= VDDQ/2
for 2.5V I/O
Thevenin equivalent:
353
/1538
5 pF*
319
/1667
DOUT
GND
Figure C: Output load(B)
*including scope
and jig capacitance
+3.3V for 3.3V I/O;
/+2.5V for 2.5V I/O
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