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Revision 1.41
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AS1751/AS1752/AS1753
Data Sheet - Ab solute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
Electrical Character-istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Signals on pins COM1, COM3, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes. For-
ward-diode current should be limited to the maximum current rating.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
V+, INx to GND
-0.3
+5
V
COMx, NOx, NCx to GND
-0.3
V+
+ 0.3
V
COMx, NOx, NCx Continuous Current
-250
+250
mA
COMx, NOx, NCx Peak Current
-350
+350
mA
Pulsed at 1ms 10% duty cycle
Continuous Power
Dissipation (TAMB = +70C)
16-pin TQFN
727
mW
Derate at 9.1W/C above +70C
14-pin TSSOP
1349
Derate at 16.9W/C above +70C
Operating Temperature Range
-40
+85
C
Electro-Static Discharge
2500
V
HBM Mil-Std883E 3015.7 methods
Latch Up Immunity
250
mA
Norm: JEDEC 17
Junction Temperature
+150
C
Storage Temperature Range
-65
+150
C
Package Body Temperature
+260
C
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
ams
AG
Technical
content
still
valid