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參數(shù)資料
| 型號(hào)： | AN-5026 |
| 廠商： | Fairchild Semiconductor Corporation |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:19; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:15; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No |
| 中文描述： | 使用的BGA封裝 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 722K |
| 代理商： | AN-5026 |
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www.fairchildsemi.com
A
BGA Routing
(Continued)
FIGURE 6. 114-Ball 36-Bit BGA Routing (74VCX32500)
FIGURE 7. 114-Ball 40-Bit BGA Routing (FST32211)
Note: The FST32211 can also be routed as a 43-bit switch without the use of vias.
Routing Power and Ground:
Power and ground balls have not been routed in the illus-
trations above because of the designers multiple routing
choices. There are generally two methods:
1. Supplying power and ground to the BGA by connecting
vias to the V
CC
/GND planes and traces under the BGA
package. See Figure 8 for via placement.
Pros: Better noise performance due to lower power
inductance (shorter V
CC
/GND trace length).
Cons: Via size under the package is restricted to
0.56mm (22.0 mil) vias.
FIGURE 8. BGA Powered
with
Vias Under the Package
2. Supplying power and ground to the BGA by connecting
vias to the V
CC
/GND plains and traces outside the BGA
package. See Figure 9.
Pros: Allows for larger vias outside the package.
Cons: Compromised noise performance through trace
length added V
CC
/GND trace length.
FIGURE 9. BGA Powered
with
Vias Outside the Package Land Area
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