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參數(shù)資料
| 型號： | AMMC-6333-W50 |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 33000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 0.100 X 0.051 INCH, DIE-9 |
| 文件頁數(shù)： | 3/11頁 |
| 文件大?。?/td> | 451K |
| 代理商： | AMMC-6333-W50 |
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright 2005-2009 Avago Technologies. All rights reserved.
AV02-1446EN - November 12, 2009
Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin llet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. The RF connections
Figure 19. Die dimensions
should be kept as short as possible to minimize induc-
tance. Double-bonding with 0.7mil gold wire is recom-
mended. The recommended wire bonding stage temper-
ature is 150±2°C.
The chip is 100μm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
Ordering Information:
AMMC-6333-W10 = 10 devices per tray
AMMC-6333-W50 = 50 devices per tray
0 120
945
2400 2500
0
GND
VD
DET_R
1300
0 120
540
2400 2500
1300
DET_O
VD
0
935
VG
GND
650
RF_IN
650
RF_OUT
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PDF描述 |
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| AMMC-6630-W10 | 5000 MHz - 45000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| AMMC-6630-W50 | 5000 MHz - 45000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| AMMC-6640 | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| AMMP-5024-BLKG | 0.03 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5024-TR1G | 0.03 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-6345 | 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:20 - 45 GHz Driver Amplifier |
| AMMC-6345-W10 | 功能描述:射頻放大器 Amp MMIC 20-45GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6345-W50 | 功能描述:射頻放大器 Amp MMIC 20-45GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6408-W10 | 功能描述:射頻放大器 Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6408-W50 | 功能描述:射頻放大器 Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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