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參數(shù)資料
| 型號： | AMIS-30660 |
| 元件分類： | CAN |
| 英文描述： | High Speed CAN Transceiver |
| 中文描述： | 高速CAN收發(fā)器 |
| 文件頁數(shù)： | 11/11頁 |
| 文件大小： | 653K |
| 代理商： | AMIS-30660 |
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive.
Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the
package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them
(the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a
solder joint between the printed-circuit board and heatsink (at
bottom version) can not be achieved, and as solder may stick
to the heatsink (on top version).
3. If wave soldering is considered, then the package must be
placed at a 45
o
angle to the solder wave direction. The
package footprint must incorporate solder thieves downstream
and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP
packages with a pitch (e) equal to or larger than 0.8mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP
packages with a pitch (e) equal to or larger than 0.65mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.5mm.
Package
Soldering Method
Wave
Not suitable
Not suitable (2)
Reflow
(1)
Suitable
Suitable
BGA, SQFP
HLQFP, HSQFP,
HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Suitable
Not recommended (3)(4)
Not recommended (5)
Suitable
Suitable
Suitable
Revision Number
Version 1
Revision 1.1
Revision 1.2
Changes on page
1 and 6
8
Copyright 2003 AMI Semiconductor – All rights reserved. Information furnished is believed to be accurate and reliable. However, AMI Semiconductor assumes no responsibility for errors or omissions in the information and for the
AMI Semiconductor
www.amis.com
AMIS-30660 High Speed CAN Transceiver
Data Sheet
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS30660CANH2G | 功能描述:CAN 接口集成電路 HS CAN TRANSC. (5V) RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS30660CANH2RG | 功能描述:CAN 接口集成電路 HS CAN TRANSC. (5V) RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS30660CANH2RG-CUT TAPE | 制造商:ON 功能描述:AMIS Series 1 Function 5.25 V Surface Mount High Speed CAN Transceiver - SOIC-8 |
| AMIS30660CANH6G | 功能描述:音頻 DSP HS CAN TRANSC. 5V NIPDAU RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Tube |
| AMIS30660CANH6RG | 功能描述:CAN 接口集成電路 HS CAN TRANSC 5V NIPDAU RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
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