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參數(shù)資料
| 型號： | AMIS-30660 |
| 元件分類： | CAN |
| 英文描述： | High Speed CAN Transceiver |
| 中文描述： | 高速CAN收發(fā)器 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 653K |
| 代理商： | AMIS-30660 |
AMIS-30660 High Speed CAN Transceiver
Data Sheet
AMI Semiconductor
www.amis.com
10
Figure 9 – Common-mode voltage peaks (see measurement setup Fig. 8.)
Soldering
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with high
population densities. In these situations reflow soldering is
often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine
solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from 215 to 250°C.
The top-surface temperature of the packages should
preferably be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended for
surface mount devices (SMDs) or printed-circuit boards with
a high component density, as solder bridging and non-
wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-
circuit board.The footprint must incorporate solder thieves
at the downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45o angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive
is cured.
Typical dwell time is 4 seconds at 250°C. A mildly-activated
flux will eliminate the need for removal of corrosive residues
in most applications.
Manual soldering
Fix the component by first soldering two diagonally-
opposite end leads. Use a low voltage (24 V or less)
soldering iron applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320°C.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS30660CANH2G | 功能描述:CAN 接口集成電路 HS CAN TRANSC. (5V) RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS30660CANH2RG | 功能描述:CAN 接口集成電路 HS CAN TRANSC. (5V) RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS30660CANH2RG-CUT TAPE | 制造商:ON 功能描述:AMIS Series 1 Function 5.25 V Surface Mount High Speed CAN Transceiver - SOIC-8 |
| AMIS30660CANH6G | 功能描述:音頻 DSP HS CAN TRANSC. 5V NIPDAU RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風格: 封裝 / 箱體: 封裝:Tube |
| AMIS30660CANH6RG | 功能描述:CAN 接口集成電路 HS CAN TRANSC 5V NIPDAU RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
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