參數(shù)資料
型號: AM50DL128BH85IT
廠商: Advanced Micro Devices, Inc.
英文描述: CA-BAYONET
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 12/68頁
文件大?。?/td> 959K
代理商: AM50DL128BH85IT
10
Am50DL128BH
October 7, 2003
A D V A N C E I N F O R M A T I O N
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the com-
mands, along with the address and data information
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables 1-2 lists the device bus operations, the
inputs and control levels they require, and the result-
ing output. The following subsections describe each of
these operations in further detail.
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AM50DL128BH Circular Connector; No. of Contacts:128; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
AM50DL128BH56I Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
AM50DL128BH56IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH56IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM50DL128CG 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG70IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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