參數(shù)資料
型號: AM50DL128BH70IT
廠商: Advanced Micro Devices, Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 6/68頁
文件大?。?/td> 959K
代理商: AM50DL128BH70IT
4
Am50DL128BH
October 7, 2003
A D V A N C E I N F O R M A T I O N
Figure 32. Pseudo SRAM Write Cycle—CE#1ps Control............... 58
Figure 33. Pseudo SRAM Write Cycle—
UB#s and LB#s Control................................................................... 59
Flash Erase And Programming Performance . . 60
Latchup Characteristics . . . . . . . . . . . . . . . . . . . 60
Package Pin Capacitance . . . . . . . . . . . . . . . . . . 60
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 61
pSRAM Data Retention . . . . . . . . . . . . . . . . . . . . 62
pSRAM Power on and Deep Power Down . . . . . 62
Figure 34. Deep Power-down Timing............................................. 62
Figure 35. Power-on Timing........................................................... 62
pSRAM Address Skew . . . . . . . . . . . . . . . . . . . . . 63
Figure 36. Read Address Skew..................................................... 63
Figure 37. Write Address Skew...................................................... 63
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 64
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm .............64
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 65
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PDF描述
AM50DL128BH85I Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM50DL128CG70IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
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參數(shù)描述
AM50DL128BH85I 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM50DL128BH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128CG 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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