參數(shù)資料
型號(hào): AM50DL128BH70IS
廠商: Advanced Micro Devices, Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 14/68頁(yè)
文件大小: 959K
代理商: AM50DL128BH70IS
12
Am50DL128BH
October 7, 2003
A D V A N C E I N F O R M A T I O N
Table 2.
Device Bus Operations—Flash Byte Mode, CIOf = V
IL
Legend:
L = Logic Low = V
, H = Logic High = V
, V
= 11.5–12.5
V, V
= 9.0 ± 0.5 V, X = Don’t Care, SA = pSRAM Address Input, Byte Mode,
SADD = Flash Sector Address, A
IN
= Address In, D
IN
= Data In, D
OUT
= Data Out
Notes:
1.
Other operations except for those indicated in this column are
inhibited.
Do not apply CE#f = V
IL
, CE1#s = V
IL
and CE2s = V
IH
at the same
time.
Active flash is device being addressed.
Don’t care or open LB#s or UB#s.
If WP#/ACC = V
, the boot sectors will be protected. If WP#/ACC
= V
the boot sectors protection will be removed.
If WP#/ACC = V
ACC
(9V), the program time will be reduced by
40%.
The sector protect and sector unprotect functions may also be
implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
2.
3.
4.
5.
6.
7.
If WP#/ACC = V
, the two outermost boot sectors remain
protected. If WP#/ACC = V
, the two outermost boot sector
protection depends on whether they were last protected or
unprotected using the method described in “Sector/Sector Block
Protection and Unprotection”. If WP#/ACC = V
HH,
all sectors will
be unprotected.
Data will be retained in pSRAM.
Data will be lost in pSRAM.
10. CE# inputs on both flash devices may be held low for this
operation.
8.
9.
Operation
(Notes 1, 2)
CE#f
Active
CE#f
Inactive
CE2s
OE#
WE#
Address
LB#s
(4)
UB#s
(4)
RESET#
WP#/ACC
(Note 5)
DQ7–
DQ0
DQ15–
DQ8
(Note 3)
Read from
Flash
(Note 8)
L
H
H
L
H
A
IN
X
X
H
L/H
D
OUT
High-Z
(Note 9)
H
L
Write to Flash
(Note 8)
L
H
H
H
L
A
IN
X
X
H
(Note 5)
D
IN
High-Z
(Note 9)
H
L
Standby
V
CC
±
0.3 V
H
H
X
X
X
X
X
V
CC
±
0.3 V
H
High-Z
High-Z
Deep Power-down
Standby
V
CC
±
0.3 V
H
L
X
X
X
X
X
V
CC
±
0.3 V
H
High-Z
High-Z
Output Disable
L
L
H
H
H
X
X
X
H
L/H
High-Z
High-Z
H
H
X
X
X
Flash Hardware
Reset
(Note 8)
X
H
H
X
X
X
X
X
L
L/H
High-Z
High-Z
(Note 9)
H
L
Sector Protect
(Note 5)
(Note 8)
L
H
H
H
L
SADD, A6 = L,
A1 = H, A0 = L
X
X
V
ID
L/H
D
IN
X
(Note 9)
H
L
Sector
Unprotect
(Note 5)
(Note 8)
L
H
H
H
L
SADD, A6 = H,
A1 = H, A0 = L
X
X
V
ID
(Note 7)
D
IN
X
(Note 9)
H
L
Temporary
Sector
Unprotect
(Note 8)
X
H
H
X
X
X
X
X
V
ID
(Note 7)
D
IN
High-Z
(Note 9)
H
L
Read from pSRAM
H
L
H
L
H
A
IN
L
L
H
X
D
OUT
D
OUT
H
L
High-Z
D
OUT
L
H
D
OUT
High-Z
Write to pSRAM
H
L
H
X
L
A
IN
L
L
H
X
D
IN
D
IN
H
L
High-Z
D
IN
L
H
D
IN
High-Z
相關(guān)PDF資料
PDF描述
AM50DL128BH70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85I Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG70IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DL128CG70IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM50DL128BH70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85I 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128BH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128CG 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM