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參數(shù)資料
| 型號(hào)： | AM49DL640BG |
| 廠商： | Spansion Inc. |
| 英文描述： | ECONOLINE: REC3-S_DRW(Z)/H4,H6 - Safety standards and approval: EN 60950 certified, rated for 250VAV (LVD test report)- Applied for Ul 1950 Component Recognised Certification- 3W DIP Package- 4kVDC & 6kVDC Isolation- Regulated Output- Continuous Short Circiut Protection Auto-Restarting |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 61/65頁 |
| 文件大?。?/td> | 1005K |
| 代理商： | AM49DL640BG |
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60
Am49DL640AG
April 1, 2003
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
FLJ073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER ASME
Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
NOT USED.
10. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3232 \ 16-038.14b
PACKAGE
FLJ 073
JEDEC
N/A
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.25
---
---
BALL HEIGHT
A2
0.95
---
1.13
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
73
BALL COUNT
0.30
0.35
0.40
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9,B2,B3,B4,B7,B8,B9
C2,C9,C10,D1,D10,E1,E10,F5,F6,G5,G6,H1,H10
DEPOPULATED SOLDER BALLS
J1,J10,K1,K2,K9,K10,L2,L3,L4,L7,L8,L9
M2,M3,M4,M5,M6,M7,M8,M9
10
INDEX MARK
73X
C
0.15
(2X)
(2X)
C
0.15
B
A
6
b
0.20 C
C
C
C
B
A
M
M
0.15
0.08
D
E
PIN A1
CORNER
C
TOP VIEW
SIDE VIEW
A2
A1
A
0.08
L
M
eD
CORNER
E1
7
SE
D1
A
B
D
C
E
F
H
G
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
PIN A1
7
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| AM49DL640BG25IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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| AM49DL640BG30IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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