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參數(shù)資料
| 型號(hào)： | AM49DL640BG |
| 廠商： | Spansion Inc. |
| 英文描述： | ECONOLINE: REC3-S_DRW(Z)/H4,H6 - Safety standards and approval: EN 60950 certified, rated for 250VAV (LVD test report)- Applied for Ul 1950 Component Recognised Certification- 3W DIP Package- 4kVDC & 6kVDC Isolation- Regulated Output- Continuous Short Circiut Protection Auto-Restarting |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁(yè)數(shù)： | 5/65頁(yè) |
| 文件大?。?/td> | 1005K |
| 代理商： | AM49DL640BG |
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Am49DL640AG
April 1, 2003
P R E L I M I N A R Y
SRAM Data Retention . . . . . . . . . . . . . . . . . . . . . . 59
Figure 34. CE1#s Controlled Data Retention Mode ........................59
Figure 35. CE2s Controlled Data Retention Mode ..........................59
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 60
FLJ073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ..............60
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 61
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL640BG30IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL640BG25IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG25IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG30IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG30IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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