- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄366544 > AM49DL640BG30IT (Spansion Inc.) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM PDF資料下載
參數(shù)資料
| 型號(hào)： | AM49DL640BG30IT |
| 廠商： | Spansion Inc. |
| 元件分類(lèi)： | DRAM |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁(yè)數(shù)： | 10/65頁(yè) |
| 文件大?。?/td> | 1005K |
| 代理商： | AM49DL640BG30IT |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)當(dāng)前第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)
April 1, 2003
Am49DL640AG
9
P R E L I M I N A R Y
ORDERING INFORMATION
The order number (Valid Combination) is formed by the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in vol-
ume for this device. Consult the local AMD sales office to confirm
availability of specific valid combinations and to check on newly re-
leased combinations.
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the com-
mands, along with the address and data information
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables 1-2 lists the device bus operations, the
inputs and control levels they require, and the result-
ing output. The following subsections describe each of
these operations in further detail.
Am49DL640
A
G
70
I
T
TAPE AND REEL
T
=
S
=
7 inches
13 inches
TEMPERATURE RANGE
I
=
Industrial (–40
°
C to +85
°
C)
SPEED OPTION
See Product Selector Guide and Valid Combinations
PROCESS TECHNOLOGY
G
=
0.17 μm
pSRAM DEVICE DENSITY
A
=
16 Mbits
AMD DEVICE NUMBER/DESCRIPTION
Am49DL640AG
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM
Valid Combinations
Order Number
Package Marking
Am49DL640AG70I
T, S
M490000025
Am49DL640AG85I
M490000026
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL640BG35IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG25IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL640BG35IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG40IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG40IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG70IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。