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參數(shù)資料
| 型號(hào)： | AM49DL640BG30IS |
| 廠商： | Spansion Inc. |
| 元件分類： | DRAM |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 53/65頁 |
| 文件大?。?/td> | 1005K |
| 代理商： | AM49DL640BG30IS |
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52
Am49DL640AG
April 1, 2003
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
t
GHEL
t
WS
OE#
CE#f
WE#
RESET#
t
DS
Data
t
AH
Addresses
t
DH
t
CP
DQ7#
D
OUT
t
WC
t
AS
t
CPH
PA
Data# Polling
A0 for program
55 for erase
t
RH
t
WHWH1 or 2
RY/BY#
t
WH
PD for program
30 for sector erase
10 for chip erase
555 for program
2AA for erase
PA for program
SADD for sector erase
555 for chip erase
t
BUSY
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SADD = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
OUT
is the data written to the device.
4. Waveforms are for the word mode.
Figure 28.
Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings
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| AM49DL640BG40IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG40IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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相關(guān)代理商/技術(shù)參數(shù) |
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| AM49DL640BG30IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG35IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG40IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM49DL640BG40IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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