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| 型號： | AM49DL322BGT85 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，同時 |
| 文件頁數(shù)： | 55/64頁 |
| 文件大?。?/td> | 570K |
| 代理商： | AM49DL322BGT85 |
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54
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
pSRAM AC CHARACTERISTICS
Read Cycle
Notes:
1. t
OD,
t
ODo
, t
BD
, and t
ODW
are defined as the time at which
the outputs achieve the open circuit condition and are
not referenced to output voltage levels.
2. If CE#, LB#, or UB# goes low at the same time or before
WE# goes high, the outputs will remain at high impedance.
3. If CE#, LB#, or UB# goes low at the same time or after WE#
goes low, the outputs will remain at high impedance.
Figure 28.
Psuedo SRAM Read Cycle
Parameter
Symbol
Description
Speed
Unit
70
85
t
RC
t
ACC
t
CO
t
OE
t
BA
t
COE
t
OEE
t
BE
t
OD
t
ODO
t
BD
t
OH
t
PM
t
PC
t
AA
t
AOH
Read Cycle Time
Min
70
85
ns
Address Access Time
Max
70
85
ns
Chip Enable Access Time
Max
70
85
ns
Output Enable Access Time
Max
25
ns
Data Byte Control Access Time
Max
25
ns
Chip Enable Low to Output Active
Min
10
ns
Output Enable Low to Output Active
Min
0
ns
Data Byte Control Low to Output Active
Min
0
ns
Chip Enable High to Output High-Z
Max
20
ns
Output Enable High to Output High-Z
Max
20
ns
Data Byte Control High to Output High-Z
Max
20
ns
Output Data Hold from Address Change
Min
10
ns
Page Mode Time
Min
70
ns
Page Mode Cycle Time
Min
30
ns
Page Mode Address Access Time
Max
30
ns
Page Output Data Hold Time
Min
10
ns
t
RC
t
ACC
Addresses
A0 to A20
CE#1
CE2
OE#
WE#
LB#, UB#
D
OUT
I/O1 to 16
t
CO
t
OH
Fixed High
High-Z
High-Z
t
OE
t
BA
t
OD
t
ODO
t
BD
Valid Data Out
Indeterminate
t
BE
t
OEE
t
COE
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL323BGB70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGT70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGT85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL324BGB70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL322BGT85S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGT85T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL323BGB70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB70S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL323BGB70T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
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