參數(shù)資料
型號: AM49DL322BGT85
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM的32兆位(4個M × 8位/ 2米x 16位),3.0伏的CMOS只,同時
文件頁數(shù): 51/64頁
文件大?。?/td> 570K
代理商: AM49DL322BGT85
50
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
Temporary Sector Unprotect
Note:
Not 100% tested.
Parameter
All Speed Options
JEDEC
Std
Description
Unit
t
VIDR
V
ID
Rise and Fall Time (See Note)
Min
500
ns
t
VHH
V
HH
Rise and Fall Time (See Note)
Min
250
ns
t
RSP
RESET# Setup Time for Temporary Sector
Unprotect
Min
4
μ
s
t
RRB
RESET# Hold Time from RY/BY# High for
Temporary Sector Unprotect
Min
4
μ
s
RESET#
t
VIDR
V
ID
V
SS
, V
IL
,
or V
IH
V
ID
V
SS
, V
IL
,
or V
IH
CE#f
WE#
RY/BY#
t
VIDR
t
RSP
Program or Erase Command Sequence
t
RRB
Figure 25.
Temporary Sector Unprotect Timing Diagram
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AM49DL322BGT85S 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit)
AM49DL322BGT85T 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit)
AM49DL323BGB70 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL323BGB70S 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit)
AM49DL323BGB70T 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit)