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參數(shù)資料
| 型號(hào)： | AM29LV128MH90RFF |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 8M X 16 FLASH 3V PROM, 90 ns, PDSO56 |
| 封裝： | REVERSE, MO-142EC, TSOP-56 |
| 文件頁(yè)數(shù)： | 6/10頁(yè) |
| 文件大?。?/td> | 273K |
| 代理商： | AM29LV128MH90RFF |
Am29LV128M
5
ADV AN CE
I N F O RM AT I O N
CONNECTION DIAGRAMS
Note: The FBGA package pinout configuration shown is preliminary. The ball count and package physical dimensions have not
yet been determined. Contact AMD for further information.
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, SSOP, PLCC,
PDIP). The package and/or data integrity may be
compromised if the package body is exposed to
temperatures above 150
°C for prolonged periods of
time.
A2
C2
D2
E2
F2
G2
H2
A3
C3
D3
E3
F3
G3
H3
A4
C4
D4
E4
F4
G4
H4
A5
C5
D5
E5
F5
G5
H5
A6
C6
D6
E6
F6
G6
H6
A7
C7
D7
E7
F7
G7
H7
DQ15/A-1
VSS
BYTE#
A16
A15
A14
A12
A13
DQ13
DQ6
DQ14
DQ7
A11
A10
A8
A9
VCC
DQ4
DQ12
DQ5
A19
A21
RESET#
WE#
DQ11
DQ3
DQ10
DQ2
A20
A18
WP#/ACC
RY/BY#
DQ9
DQ1
DQ8
DQ0
A5
A6
A17
A7
OE#
VSS
CE#
A0
A1
A2
A4
A3
A1
C1
D1
E1
F1
G1
H1
NC
VIO
NC
A8
C8
B2
B3
B4
B5
B6
B7
B1
B8
D8
E8
F8
G8
H8
NC
VSS
VIO
NC
A22
NC
Fortified BGA
Top View, Balls Facing Down
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29LV128ML113REI | 制造商:Spansion 功能描述:Flash Mem Parallel 3.3V 128M-Bit 16M x 8/8M x 16 110ns 56-Pin TSOP |
| AM29LV128ML123REI | 制造商:Spansion 功能描述:Flash Mem Parallel 3.3V 128M-Bit 16M x 8/8M x 16 120ns 56-Pin TSOP |
| AM29LV128ML-123REI | 制造商:Advanced Micro Devices 功能描述:8M X 16 FLASH 3V PROM, 120 ns, PDSO56 |
| AM29LV160BT-120EI | 制造商:Advanced Micro Devices 功能描述:Flash Mem Parallel 3V/3.3V 16M-Bit 2M x 8/1M x 16 90ns 48-Pin TSOP Tray |
| AM29LV160BT80SC | 制造商:AMD 功能描述:* |
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