參數(shù)資料
型號: AM29LV128MH90RFF
廠商: SPANSION LLC
元件分類: PROM
英文描述: 8M X 16 FLASH 3V PROM, 90 ns, PDSO56
封裝: REVERSE, MO-142EC, TSOP-56
文件頁數(shù): 3/10頁
文件大?。?/td> 273K
代理商: AM29LV128MH90RFF
2
Am29LV128M
ADV AN CE
I N F O RM AT I O N
GENERAL DESCRIPTION
The Am29LV128M is a 128 Mbit, 3.0 volt single power
supply flash memory devices organized as 8,388,608
words or 16,777,216 bytes. The device has a 16-bit
wide data bus that can also function as an 8-bit wide
data bus by using the BYTE# input. The device can be
programmed either in the host system or in standard
EPROM programmers.
An access time of 90, 100, 110, or 120 ns is available.
Note that each access time has a specific operating
voltage range (V
CC) and an I/O voltage range (VIO), as
specified in the Product Selector Guide and the Order-
ing Information sections. The device is offered in a
56-pin TSOP or Fortified BGA package. Each device
has separate chip enable (CE#), write enable (WE#)
and output enable (OE#) controls.
Each device requires only a single 3.0 volt power
supply for both read and write functions. In addition to
a V
CC input, a high-voltage accelerated program
(WP#/ACC) input provides shorter programming times
through increased current. This feature is intended to
facilitate factory throughput during system production,
but may also be used in the field if desired.
The device is entirely command set compatible with
the JEDEC single-power-supply Flash standard.
Commands are written to the device using standard
microprocessor write timing. Write cycles also inter-
nally latch addresses and data needed for the pro-
gramming and erase operations.
The sector erase architecture allows memory sec-
tors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through
command sequences. Once a program or erase oper-
ation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle) status bits or
monitor the Ready/Busy# (RY/BY#) output to deter-
mine whether the operation is complete. To facilitate
programming, an Unlock Bypass mode reduces com-
mand sequence overhead by requiring only two write
cycles to program data instead of four.
The VersatileI/O (V
IO) control allows the host sys-
tem to set the voltage levels that the device generates
and tolerates voltages on CE# and DQ I/Os to the
same voltage level that is asserted on the V
IO pin. This
allows the device to operate in a 1.8 V or 3 V system
environment as required.
Hardware data protection measures include a low
V
CC detector that automatically inhibits write opera-
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of sectors of memory.
This can be achieved in-system or via programming
equipment.
The Erase Suspend/Erase Resume feature allows
the host system to pause an erase operation in a
given sector to read or program any other sector and
then complete the erase operation. The Program
Suspend/Program Resume feature enables the host
system to pause a program operation in a given sector
to read any other sector and then complete the pro-
gram operation.
The hardware RESET# pin terminates any operation
in progress and resets the device, after which it is then
ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would
thus also reset the device, enabling the host system to
read boot-up firmware from the Flash memory device.
T he device reduces power c ons umption in the
standby mode when it detects specific voltage levels
on CE# and RESET#, or when addresses have been
stable for a specified period of time.
The SecSi
(Secured Silicon) Sector provides a
128-word/256-byte area for code or data that can be
permanently protected. Once this sector is protected,
no further changes within the sector can occur.
The Write Protect (WP#/ACC) feature protects the
first or last sector by asserting a logic low on the WP#
pin.
AMD MirrorBit flash technology combines years of
Flash memory manufacturing experience to produce
the highest levels of quality, reliability and cost effec-
tiveness. The device electrically erases all bits within a
sector simultaneously via hot-hole assisted erase. The
data is programmed using hot electron injection.
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