參數(shù)資料
型號(hào)： AM29BDS320GBD3VMF
廠商： SPANSION LLC
元件分類： PROM
英文描述： 2M X 16 FLASH 1.8V PROM, 70 ns, PBGA64
封裝： 8 X 9 MM, 0.80 MM PITCH, FBGA-64
文件頁數(shù)： 71/75頁
文件大?。?/td> 1075K
代理商： AM29BDS320GBD3VMF
May 15, 2007 27243B2
Am29BDS320G
71
Data
Sheet
Physical Dimensions
VBD064—64-ball Fine-Pitch Ball Grid Array (FBGA)
8 x 9 mm Package
Note: BSC is an ANSI standard for Basic Space Centering.
PACKAGE
VBD 064
JEDEC
N/A
8.95 mm x 7.95 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.00
OVERALL THICKNESS
A1
0.20
---
0.30
BALL HEIGHT
A2
0.62
---
0.76
BODY THICKNESS
D
8.95 BSC.
BODY SIZE
E
7.95 BSC.
BODY SIZE
D1
5.60 BSC.
BALL FOOTPRINT
E1
5.60 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
8
ROW MATRIX SIZE E DIRECTION
N
64
TOTAL BALL COUNT
φb
0.30
0.35
0.40
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
NONE
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
SIDE VIEW
A2
A
SEATING PLANE
C
0.10
0.08
A1
TOP VIEW
10
C
(2X)
0.05
(2X)
C
0.05
A
B
INDEX MARK
CORNER
PIN A1
E
D
BOTTOM VIEW
A1 CORNER
SD
SE
7
E1
e
D1
AB
NX
φb
M
φ 0.15
φ 0.08 M
C
6
G
H
8
6
5
4
3
2
1
B
A
7
D C
E
F
相關(guān)PDF資料
PDF描述
AM29BDS320GTC8VMF 2M X 16 FLASH 1.8V PROM, 90 ns, PBGA64
AM29DL163CB70RZCB 2M X 8 FLASH 3V PROM, 70 ns, PDSO48
AM29DL162CB120WCEB 2M X 8 FLASH 3V PROM, 120 ns, PBGA48
AM29DL162CB120EIN 2M X 8 FLASH 3V PROM, 120 ns, PDSO48
AM29DL162CT120EIB 2M X 8 FLASH 3V PROM, 120 ns, PDSO48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM29BDS643GT5KVAI 制造商:Spansion 功能描述:FLASH PARALLEL 1.8V 64MBIT 4MX16 55NS 44FBGA - Trays
AM29BL802CB-65RZET 制造商:Spansion 功能描述:
AM29C01WW WAF 制造商:Advanced Micro Devices 功能描述:
AM29C10API 制造商:Rochester Electronics LLC 功能描述:- Bulk
AM29C10AWW DIE 制造商:Advanced Micro Devices 功能描述:
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*