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參數(shù)資料
| 型號： | AH225-S8G |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 放大器 |
| 英文描述： | 400 MHz - 2700 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-012, SOIC-8 |
| 文件頁數(shù)： | 13/21頁 |
| 文件大?。?/td> | 1678K |
| 代理商： | AH225-S8G |
AH225
1W High Linearity InGaP HBT Amplifier
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-compliant. The plating
material on the leads is NiPdAu. It is compatible with
both lead-free (maximum 260 °C reflow temperature)
and lead (maximum 245 °C reflow temperature)
soldering processes.
The AH225 will be marked with an “AH225G”
designator with a lot code marked below the part
designator. The “Y” represents the last digit of the year
the part was manufactured, the “XXXX” is an auto-
generated number, and “Z” refers to a wafer number in a
lot batch.
Mounting Configuration
Data Sheet: Rev D 01/26/11
- 20 of 21 -
Disclaimer: Subject to change without notice
2010 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network
Notes:
1. A heat sink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device
can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”) or equivalent.
3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a heat sink. Ensure that the ground / thermal via region contact the heat
sink.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heat sink.
6. RF Trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
相關(guān)PDF資料 |
PDF描述 |
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| AH478Z5-BE1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -10-10mT, RECTANGULAR, THROUGH HOLE MOUNT |
| AH478Z5-BG1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -10-10mT, RECTANGULAR, THROUGH HOLE MOUNT |
| AH9248N-G1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -.5-5.5mT, 1mA, RECTANGULAR, SURFACE MOUNT |
| AH9248Z3-G1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -.5-5.5mT, 1mA, RECTANGULAR, THROUGH HOLE MOUNT |
| AH9249Z3TR-G1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -.5-5.5mT, 1mA, RECTANGULAR, THROUGH HOLE MOUNT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH225-S8PCB1960 | 功能描述:射頻放大器 1930-1960MHz 1W Eval Board RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AH225-S8PCB2140 | 功能描述:射頻放大器 2110-2170MHz 1W Eval Board RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AH225-S8PCB900 | 功能描述:射頻放大器 920-960MHz 1W Eval Board RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AH225-S8TRG | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
| AH225-VLR11E3 | 制造商:Fuji Electric 功能描述: |
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