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參數(shù)資料
| 型號(hào)： | AH125-89G |
| 廠(chǎng)商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類(lèi)： | 放大器 |
| 英文描述： | 400 MHz - 3600 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | GREEN, TO-243C, SOT-89, 3 PIN |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大?。?/td> | 1145K |
| 代理商： | AH125-89G |
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
Phone 503-615-9000 FAX: 503-615-8900 e-mail: info-sales@tqs.com Web site: www.TriQuint.com
Page 12 of 12 April 2010
AH125
W High Linearity InGaP HBT Amplifier
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C reflow temperature) and leaded
(maximum 245
°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The AH125 will be marked with an
“AH125G” designator with a lot code marked
below the part designator. The “Y” represents
the last digit of the year the part was
manufactured, the “XXX” is an auto-
generated number, and “Z” refers to a wafer
number in a batch.
MSL / ESD Rating
ESD Rating:
Class 2
Value:
Passes
2000V to <4000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating:
Class IV
Value:
Passes ≥ 2000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Angles are in
degrees.
YXXX-Z
AH125G
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AH212-S8G | 1800 MHz - 2400 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| AH212-EG | 1800 MHz - 2400 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| AH225-S8G | 400 MHz - 2700 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AH478Z5-BE1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -10-10mT, RECTANGULAR, THROUGH HOLE MOUNT |
| AH478Z5-BG1 | MAGNETIC FIELD SENSOR-HALL EFFECT, -10-10mT, RECTANGULAR, THROUGH HOLE MOUNT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH125-89PCB1960 | 功能描述:射頻開(kāi)發(fā)工具 .4-2.7GHz Eval Board RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH125-89PCB2140 | 功能描述:射頻開(kāi)發(fā)工具 .4-2.7GHz Eval Board RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH125-89PCB900 | 功能描述:射頻開(kāi)發(fā)工具 .4-2.7GHz Eval Board RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH125-89TRG | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
| AH128-89G | 功能描述:射頻放大器 1/4W HI LIN HBT AMP 50-3500MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類(lèi)型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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