2-6 Revision 17 Thermal Characteristics Introduction The temperature variable in the Microsemi " />
參數(shù)資料
型號： AGLN125V2-CSG81
廠商： Microsemi SoC
文件頁數(shù)： 66/150頁
文件大?。?/td> 0K
描述： IC FPGA NANO 1KB 125K 81-CSP
標(biāo)準(zhǔn)包裝： 640
系列： IGLOO nano
邏輯元件/單元數(shù)： 3072
RAM 位總計(jì)： 36864
輸入/輸出數(shù)： 60
門數(shù)： 125000
電源電壓： 1.14 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -20°C ~ 70°C
封裝/外殼： 81-WFBGA，CSBGA
供應(yīng)商設(shè)備封裝： 81-CSP（5x5）
IGLOO nano DC and Switching Characteristics
2-6
Revision 17
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
–
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
C70C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Pin
Count
jc
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
36
TBD
C/W
81
TBD
C/W
Quad Flat No Lead (QFN)
48
TBD
C/W
68
TBD
C/W
100
TBD
C/W
Very Thin Quad Flat Pack (VQFP)
100
10.0
35.3
29.4
27.1
C/W
Table 2-6
Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC = 1.425 V)
For IGLOO nano V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
–20°C
0°C
25°C
70°C
85°C
100°C
1.425
0.947
0.956
0.965
0.978
1.000
1.009
1.013
1.5
0.875
0.883
0.892
0.904
0.925
0.932
0.937
1.575
0.821
0.829
0.837
0.848
0.868
0.875
0.879
相關(guān)PDF資料
PDF描述
RMC50DRTH-S93 CONN EDGECARD 100PS DIP .100 SLD
HMC44DRTN-S93 CONN EDGECARD 88POS DIP .100 SLD
HMC44DRTH-S93 CONN EDGECARD 88POS DIP .100 SLD
HMC44DREN-S93 CONN EDGECARD 88POS .100 EYELET
BR24T64NUX-WTR IC EEPROM I2C 64K 400KHZ 8-VSON
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN125V2-CSG81I 功能描述:IC FPGA NANO 1KB 125K 81-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
AGLN125V2-CSG81Y 制造商:Microsemi Corporation 功能描述:Res Thick Film NET 2K Ohm 5% 7/20W ±300ppm/°C ISOL Ceramic 14-Pin Flat Flat SMD Tube
AGLN125V2-DIELOT 制造商:Microsemi Corporation 功能描述:AGLN125V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
AGLN125V2-QNG100 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO 125K GATES COMM 130NM 1.2V/1.5V 100QFN - Trays
AGLN125V2-QNG100I 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO 125K GATES IND 130NM 1.2V/1.5V 100QFN - Trays
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*