2-6 Revision 13 Package Thermal Characteristics The device junction-to-case thermal resistivity is " />
參數(shù)資料
型號： AGLE3000V2-FGG896I
廠商： Microsemi SoC
文件頁數(shù)： 80/166頁
文件大小： 0K
描述： IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝： 27
系列： IGLOOe
邏輯元件/單元數(shù)： 75264
RAM 位總計(jì)： 516096
輸入/輸出數(shù)： 620
門數(shù)： 3000000
電源電壓： 1.14 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 896-BGA
供應(yīng)商設(shè)備封裝： 896-FBGA（31x31）
IGLOOe DC and Switching Characteristics
2-6
Revision 13
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction
temperature is 100°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation
allowed for an 896-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
–
ja(C/W)
---------------------------------------------------------------------------------------------------------------------------------
100
C70C
–
13.6
C/W
-----------------------------------
2.206 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Pin Count
jc
ja
Units
Still Air
200 ft./min.
500 ft./min.
Plastic Quad Flat Package (PQFP)
208
8.0
26.1
22.5
20.8
C/W
Plastic Quad Flat Package (PQFP) with
embedded heat spreader
208
3.8
16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.9
22.8
21.5
C/W
484
3.2
20.5
17.0
15.9
C/W
676
3.2
16.4
13.0
12.0
C/W
896
2.4
13.6
10.4
9.4
C/W
Table 2-6
Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C,VCC = 1.425 V)
For IGLOOe V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.945
0.965
0.978
1.000
1.008
1.013
1.500
0.876
0.893
0.906
0.927
0.934
0.940
1.575
0.824
0.840
0.852
0.872
0.879
0.884
Table 2-7
Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.14 V)
For IGLOOe V2, 1.2 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.14
0.968
0.978
0.991
1.000
1.006
1.010
1.20
0.864
0.873
0.885
0.893
0.898
0.902
1.26
0.793
0.803
0.813
0.821
0.826
0.829
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