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參數(shù)資料
| 型號： | ADSP-2189MKCAZ-300 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 8/32頁 |
| 文件大小： | 0K |
| 描述： | IC DSP CONTROLLER 16BIT 144-MBGA |
| 標準包裝： | 1 |
| 系列： | ADSP-21xx |
| 類型： | 定點 |
| 接口： | 主機接口，串行端口 |
| 時鐘速率： | 75MHz |
| 非易失內(nèi)存： | 外部 |
| 芯片上RAM： | 192kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 2.50V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 144-LFBGA |
| 供應商設(shè)備封裝： | 144-迷你型BGA |
| 包裝： | 托盤 |
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REV. A
ADSP-2189M
–16–
FREQUENCY DEPENDENCY FOR TIMING
SPECIFICATIONS
tCK is defined as 0.5tCKI. The ADSP-2189M uses an input clock
with a frequency equal to half the instruction rate: a 37.50 MHz
input clock (which is equivalent to 28 ns) yields a 13 ns proces-
sor cycle (equivalent to 75 MHz). tCK values within the range of
0.5tCKI period should be substituted for all relevant timing pa-
rameters to obtain the specification value.
Example: tCKH = 0.5tCK – 7 ns = 0.5 (15 ns) – 7 ns = 0.5 ns
ENVIRONMENTAL CONDITIONS
1
Rating Description
Symbol
Value
Thermal Resistance
(Case-to-Ambient)
θ
CA
48
°C/W
(Junction-to-Ambient)
θJA
50
°C/W
(Junction-to-Case)
θJC
2
°C/W
NOTE
1Where the ambient temperature rating (T
AMB) is:
TAMB = TCASE – (PD
× θCA)
TCASE = Case temperature in
°C
PD = Power dissipation in W.
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C
× VDD2 × f
C = load capacitance, f = output switching frequency.
Example:
In an application where external data memory is used and no
other outputs are active, power dissipation is calculated as follows:
Assumptions:
External data memory is accessed every cycle with 50% of
the address pins switching.
External data memory writes occur every other cycle with
50% of the data pins switching.
Each address and data pin has a 10 pF total load at the pin.
The application operates at VDDEXT = 3.3 V and tCK = 15 ns.
Total Power Dissipation = PINT + (C
× VDDEXT2 × f)
PINT = internal power dissipation from Power vs. Frequency
graph (Figure 15).
(C
× VDDEXT2 × f) is calculated for each output:
# of
Parameters
Pins C
VDDEXT
2
fPD
Address,
DMS
8
10 pF
3.3
2 V
33.3 MHz
29.0 mW
Data Output,
WR 9
10 pF
3.3
2 V
16.67 MHz
16.3 mW
RD
1
10 pF
3.3
2 V
16.67 MHz
1.8 mW
CLKOUT
1
10 pF
3.3
2 V
33.3 MHz
3.6 mW
50.7 mW
Total power dissipation for this example is PINT + 50.7 mW.
Output Drive Currents
Figure 14 shows typical I-V characteristics for the output drivers
on the ADSP-2189M. The curves represent the current drive
capability of the output drivers as a function of output voltage.
VOH
VOL
SOURCE VOLTAGE – V
0
0.5
1.0
SOURCE
CURRENT
–
mA
60
0
–20
–40
–60
40
20
VDDEXT = 3.6V @ –40 C
VDDEXT = 3.3V @ +25 C
VDDEXT = 2.5V @ +85 C
VDDEXT = 3.3V @ +25 C
VDDEXT = 3.6V @ –40 C
80
–80
1.5
2.0
2.5
3.0
3.5
4.0
Figure 14. Typical Output Driver Characteristics
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADSP-2189MKST-300 | 制造商:Analog Devices 功能描述:DSP Fixed-Point 16-Bit 75MHz 75MIPS 100-Pin LQFP 制造商:Rochester Electronics LLC 功能描述:32K/48K 16 BIT DSP 75 MIPS - Bulk 制造商:Analog Devices 功能描述:IC MICROCOMPUTER 16-BIT |
| ADSP-2189MKSTZ-300 | 功能描述:IC DSP CONTROLLER 16BIT 100-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:ADSP-21xx 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| ADSP-2189MKSTZ-300 | 制造商:Analog Devices 功能描述:IC 16-BIT MICROCOMPUTER |
| ADSP-2189N | 制造商:AD 制造商全稱:Analog Devices 功能描述:DSP Microcomputer |
| ADSP-2189NBCA-320 | 功能描述:IC DSP 16BIT 80MHZ 144CSPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:ADSP-21xx 標準包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤 |
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