參數(shù)資料
型號： ADS8481IBRGZRG4
英文描述： 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
中文描述： 18位，1 MSPS的，偽差分單極輸入，微采樣模擬到數(shù)字轉(zhuǎn)換并行接口和參考
文件頁數(shù)： 25/31頁
文件大小： 717K
代理商： ADS8481IBRGZRG4
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
TQFP
TQFP
QFN
Package
Drawing
PFB
PFB
RGZ
Pins Package
Qty
1000
250
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
1000
250
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
250
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
ADS8481IBPFBR
ADS8481IBPFBT
ADS8481IBRGZR
PREVIEW
PREVIEW
ACTIVE
48
48
48
TBD
TBD
Call TI
Call TI
CU NIPDAU
Call TI
Call TI
Level-2-260C-1 YEAR
ADS8481IBRGZRG4
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481IBRGZT
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481IBRGZTG4
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481IPFBR
ADS8481IPFBT
ADS8481IRGZR
PREVIEW
PREVIEW
ACTIVE
TQFP
TQFP
QFN
PFB
PFB
RGZ
48
48
48
TBD
TBD
Call TI
Call TI
CU NIPDAU
Call TI
Call TI
Level-2-260C-1 YEAR
ADS8481IRGZRG4
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481IRGZT
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481IRGZTG4
ACTIVE
QFN
RGZ
48
CU NIPDAU
Level-2-260C-1 YEAR
ADS8481PFBR
ADS8481RGZR
PREVIEW
PREVIEW
TQFP
QFN
PFB
RGZ
48
48
TBD
TBD
Call TI
Call TI
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
相關(guān)PDF資料
PDF描述
ADS8481IBRGZT 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IBRGZTG4 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IPFBR 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IPFBT 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IRGZR 18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADS8481IBRGZT 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 18-Bit 1-MSPS Pseudo Diff Unipolar Input RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8481IBRGZTG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 18-Bit 1-MSPS Pseudo Diff Unipolar Input RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8481IPFBR 制造商:BB 制造商全稱:BB 功能描述:18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IPFBT 制造商:BB 制造商全稱:BB 功能描述:18-BIT, 1-MSPS, PSEUDO-DIFFERENTIAL UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE AND REFERENCE
ADS8481IRGZR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 18-Bit 1MSPS Parall ADC w/Ref RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
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