參數(shù)資料
型號(hào): ADS62P42IRGCTG4
廠商: Texas Instruments
文件頁數(shù): 68/78頁
文件大?。?/td> 0K
描述: IC ADC 14BIT SER/PAR 65M 64VQFN
產(chǎn)品培訓(xùn)模塊: Data Converter Basics
標(biāo)準(zhǔn)包裝: 250
位數(shù): 14
采樣率(每秒): 65M
數(shù)據(jù)接口: 串行,并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-VQFN 裸露焊盤(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 2 個(gè)差分,單極
SLAS561C
– JULY 2007 – REVISED FEBRUARY 2012
REVISION HISTORY
Changes from Revision A (February 2008) to Revision B
Page
Added Aperature delay matching to TIMING REQUIREMENTS
— LVDS AND CMOS MODES ........................................ 8
Added tSTART description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ..................................................... 9
Added tDV description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .......................................................... 9
Added tSTART_CHA description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ............................................... 9
Added tDV_CHA description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .................................................... 9
Added tSTART_CHB description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ............................................... 9
Added tDV_CHB description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .................................................... 9
Changed Figure 3 CMOS Mode Timing ............................................................................................................................. 12
Added Figure 4 Multiplexed Mode Timing (CMOS only) .................................................................................................... 12
Added text to USING PARALLEL INTERFACE CONTROL ONLY section description ..................................................... 13
Added voltage values to Table 4 ........................................................................................................................................ 14
Added voltage values to Table 5 ........................................................................................................................................ 14
Changed Channel A and B powered down to Power down global in Table 6 .................................................................... 14
Changed DB10 to DB0 to DB13 to DB0 inTable 6 ............................................................................................................. 14
Added Serial Register Readout section .............................................................................................................................. 17
Added SERIAL READOUT to register address 00 in Table 7 ............................................................................................ 20
Added SERIAL READOUT to register address 00 description ........................................................................................... 21
Changed register address 14, bits D2-D0 111 description from DA10 to DA0 to DB13 to DB0 pins ................................ 23
Changed pin 56 from NC to SDOUT in CMOS interface pinout ......................................................................................... 28
Changed pin 56 from NC to SDOUT and added SDOUT description in Pin Assignments (CMOS INTERFACE) ............ 29
Changed Channel A and B powered down to Global power down in Table 21 ................................................................. 55
Changed DA13 to DA0 to DB13 to DB0 in Table 21 .......................................................................................................... 55
Changed DB0-DB10 to DB0-DB13 in Multiplexed Output Mode description ..................................................................... 60
Changed DA0-DA10 to DA0-DA13 in Multiplexed Output Mode description ..................................................................... 60
Changes from Revision B (May 2009) to Revision C
Page
Changed label positions for DDR LVDS Output Data DXP, DXM in Figure 1 .................................................................... 11
Changed D3 for register 16 ................................................................................................................................................ 24
Changed pins 29, 30 and 19, 20 in CMOS interface pinout ............................................................................................... 28
Changed pins 29, 30 in Pin Assignments CMOS INTERFACE ......................................................................................... 29
Changed pins 19, 20 in Pin Assignments CMOS INTERFACE ......................................................................................... 29
Changed pins 29, 30 and 19, 20 in LVDS interface pinout ................................................................................................ 30
Changed pins 29, 30 in Pin Assignments LVDS INTERFACE ........................................................................................... 30
Changed pins 19, 20 in Pin Assignments LVDS INTERFACE ........................................................................................... 30
Changed rising edge to falling edge and falling edge to rising edge in paragraph after Figure 95. ................................... 57
70
Copyright
2007–2012, Texas Instruments Incorporated
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