SLAS561C
– JULY 2007 – REVISED FEBRUARY 2012
REVISION HISTORY
Changes from Revision A (February 2008) to Revision B
Page
Added Aperature delay matching to TIMING REQUIREMENTS
— LVDS AND CMOS MODES ........................................
8Added tSTART description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ..................................................... 9 Added tDV description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .......................................................... 9 Added tSTART_CHA description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ............................................... 9 Added tDV_CHA description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .................................................... 9 Added tSTART_CHB description to TIMING REQUIREMENTS — LVDS AND CMOS MODES ............................................... 9 Added tDV_CHB description to TIMING REQUIREMENTS — LVDS AND CMOS MODES .................................................... 9 Changed
Figure 3 CMOS Mode Timing .............................................................................................................................
12Added
Figure 4 Multiplexed Mode Timing (CMOS only) ....................................................................................................
12Added text to USING PARALLEL INTERFACE CONTROL ONLY section description .....................................................
13Added voltage values to
Table 4 ........................................................................................................................................
14Added voltage values to
Table 5 ........................................................................................................................................
14Changed Channel A and B powered down to Power down global in
Table 6 ....................................................................
14Changed DB10 to DB0 to DB13 to DB0 in
Table 6 .............................................................................................................
14Added Serial Register Readout section ..............................................................................................................................
17Added SERIAL READOUT to register address 00 in
Table 7 ............................................................................................
20Added SERIAL READOUT to register address 00 description ...........................................................................................
21Changed register address 14, bits D2-D0 111 description from DA10 to DA0 to DB13 to DB0 pins ................................
23Changed pin 56 from NC to SDOUT in CMOS interface pinout .........................................................................................
28Changed pin 56 from NC to SDOUT and added SDOUT description in Pin Assignments (CMOS INTERFACE) ............
29Changed Channel A and B powered down to Global power down in
Table 21 .................................................................
55Changed DA13 to DA0 to DB13 to DB0 in
Table 21 ..........................................................................................................
55Changed DB0-DB10 to DB0-DB13 in Multiplexed Output Mode description .....................................................................
60Changed DA0-DA10 to DA0-DA13 in Multiplexed Output Mode description .....................................................................
60Changes from Revision B (May 2009) to Revision C
Page
Changed label positions for DDR LVDS Output Data DXP, DXM in
Figure 1 ....................................................................
11Changed D3 for register 16 ................................................................................................................................................
24Changed pins 29, 30 and 19, 20 in CMOS interface pinout ...............................................................................................
28Changed pins 29, 30 in Pin Assignments CMOS INTERFACE .........................................................................................
29Changed pins 19, 20 in Pin Assignments CMOS INTERFACE .........................................................................................
29Changed pins 29, 30 and 19, 20 in LVDS interface pinout ................................................................................................
30Changed pins 29, 30 in Pin Assignments LVDS INTERFACE ...........................................................................................
30Changed pins 19, 20 in Pin Assignments LVDS INTERFACE ...........................................................................................
30Changed rising edge to falling edge and falling edge to rising edge in paragraph after
Figure 95. ...................................
5770
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2007–2012, Texas Instruments Incorporated