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參數(shù)資料
| 型號(hào)： | ADS5541 |
| 英文描述： | MOSFET, N SC-75AMOSFET, N SC-75A; Transistor type:MOSFET; Transistor polarity:N; Voltage, Vds max:20V; Case style:SC-75A; Current, Id cont:0.14A; Current, Idm pulse:0.5A; Power, Pd:0.25W; Resistance, Rds on:10R; SMD:1; Depth, |
| 中文描述： | 14位，80Msps模擬到數(shù)字轉(zhuǎn)換器 |
| 文件頁數(shù)： | 27/30頁 |
| 文件大?。?/td> | 401K |
| 代理商： | ADS5541 |
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SBAS308A MAY 2004 REVISED MARCH 2005
www.ti.com
27
Assembly Process
1.
Prepare the PCB top-side etch pattern including
etch for the leads as well as the thermal pad as
illustrated in the
Mechanical Data
section.
2.
Place a 5-by-5 array of thermal vias in the thermal
pad area. These holes should be 13 mils in
diameter. The small size prevents wicking of the
solder through the holes.
3.
It is recommended to place a small number of 25 mil
diameter holes under the package, but outside the
thermal pad area to provide an additional heat path.
4.
Connect all holes (both those inside and outside the
thermal pad area) to an internal copper plane (such
as a ground plane).
5.
Do not use the typical web or spoke via connection
pattern when connecting the thermal vias to the
ground plane. The spoke pattern increases the
thermal resistance to the ground plane.
6.
The topside solder mask should leave exposed
the terminals of the package and the thermal pad
area.
7.
Cover the entire bottom side of the PowerPAD vias
to prevent solder wicking.
8.
Apply solder paste to the exposed thermal pad area
and all of the package terminals.
For more detailed information regarding the PowerPAD
package and its thermal properties, please refer to
either Application Brief SLMA004B (
PowerPAD Made
Easy
), or Technical Brief SLMA002 (
PowerPAD
Thermally Enhanced Package
), both available for
download at www.ti.com.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADS5541EVM | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 ADS5541 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評(píng)估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| ADS5541IPAP | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 14-Bit 105MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| ADS5541IPAPG4 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 14-Bit 105MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| ADS5541IPAPR | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 14-Bit 105MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| ADS5541IPAPRG4 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 14-Bit 105MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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