ADF4212L
Data Sheet
Rev. E | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Rating
VDD1 to GND
0.3 V to +3.6 V
VDD1 to VDD2
0.3 V to +0.3 V
VP1, VP2 to GND
0.3 V to +5.8 V
VP1, VP2 to VDD1, VDD2
0.3 V to +5.8 V
Digital I/O Voltage to GND
0.3 V to DVDD + 0.3 V
Analog I/O Voltage to GND
0.3 V to VDD + 0.3 V
REFIN, RFIN, IFIN to GND
0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
TSSOP θJA Thermal Impedance
150.4°C/W
LFCSP θJA Thermal Impedance
(Paddle Soldered)
122°C/W
LFCSP θJA Thermal Impedance
(Paddle Not Soldered)
216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1
This device is a high performance RF integrated circuit with an ESD rating of
<2 kV, and is ESD sensitive. Proper precautions should be taken for handling
and assembly.
2
GND = AGND = DGND = 0 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION