參數(shù)資料
型號: ADA4830-2BCPZ-R7
廠商: Analog Devices Inc
文件頁數(shù): 8/23頁
文件大小: 0K
描述: IC AMP BATT PROTECT DUAL 16LFCSP
標(biāo)準(zhǔn)包裝: 1
放大器類型: 差分
電路數(shù): 2
轉(zhuǎn)換速率: 220 V/µs
-3db帶寬: 84MHz
電流 - 電源: 6.8mA
電流 - 輸出 / 通道: 125mA
電壓 - 電源,單路/雙路(±): 2.9 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP-WQ(3x3)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ADA4830-2BCPZ-R7DKR
Data Sheet
ADA4830-1/ADA4830-2
Rev. C | Page 15 of 22
INPUT COMMON-MODE RANGE
In a standard four resistor difference amplifier with 0.50 V/V
gain, the input common-mode (CM) range is three times the CM
range of the core amplifier. In the ADA4830-1 and ADA4830-2,
however, the input CM range has been extended to more than 18 V
(with a 5 V supply). The input CM range can be approximated
by using the following formulas:
For the maximum CM voltage,
5(+VS 1.25) 4VREF ≈ VINCM(MAX) ≤ 9.5 V
For the minimum CM voltage,
10 V ≤ VINCM(MIN) ≈ (1 + 4VREF)
Approximate minimum and maximum CM voltages are shown
in Table 7 for several common supply voltages.
Table 7. Input Common-Mode Range Examples
+VS (V)
VREF (V)
VINCM(MIN) (V)
VINCM(MAX) (V)
3.0
–7.0
2.8
3.0
–4.9
4.9
3.3
–7.6
3.6
3.3
–5.6
5.6
3.6
–8.2
4.5
3.6
–6.4
6.4
5.0
–10
8.7
5.0
2.22
–9.9
9.5
1
Floating (default condition).
–15
–10
–5
0
5
10
15
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IN
PU
T
C
O
MMO
N
-MO
D
E
VO
LT
A
G
E
(V)
SUPPLY VOLTAGE (V)
VINCM (MAX)
VINCM (MIN)
VREF PIN FLOATING
10020-
037
Figure 33. Input Common-Mode Range vs. Supply Voltage
SHORT-TO-BATTERY OUTPUT FLAG PIN
The flag output (STB) is an active low, open-drain logic
configuration. A low level on this output indicates that an
overvoltage event has been detected on either the positive or
the negative input or both. Flags from multiple chips can be
wire-OR'ed to form a single fault detection signal. The output is
driven by a grounded source NMOS device, capable of sinking
approximately 10 mA while pulling within a few hundred millivolts
above ground. The output high level is set with an external pull-up
resistor connected to the supply voltage of the logic family that is
used to monitor the state of the flag.
In the falling direction, the speed with which the flag output
responds primarily depends on the external capacitance attached to
this node and the sink current that can be provided. For example, if
the load is 10 pF, and the external pull-up voltage is 3.3 V, the fall
time is a few nanoseconds. In the rising direction, the speed is
determined by external capacitance and the magnitude of the
pull-up resistor. For the case of 10 pF of external capacitance
and a pull-up of 5 k, the time constant of the rising edge is
approximately 50 ns.
Table 8. STB Pin Function
STB Pin Output
Device State
High (Logic 1)
Normal operation
Low (Logic 0)
STB fault condition
ENABLE/DISABLE MODES (ENA PIN)
The power-down, or enable/disable (ENA) pin, is internally pulled
up to +VS through a 250 k resistor. When the voltage on this
pin is high, the amplifier is enabled; pulling ENA low disables
the channel. With no external connection, this pin floats high,
enabling the amplifier channel.
Table 9. ENA Pin Function
ENA Pin Input
Device State
High (Logic 1)
Enabled
Low (Logic 0)
Disabled
High-Z (Floating)
Normal operation
PCB LAYOUT
As with all high speed applications, attention to PCB layout is of
paramount importance. Adhere to standard high speed layout
practices in designs using the ADA4830-1 and ADA4830-2. A
solid ground plane is recommended, and placing a 0.1 F surface-
mount, ceramic power supply, decoupling capacitor as close as
possible to the supply pin(s) is recommended.
Connect the GND pin(s) to the ground plane with a trace that is as
short as possible. In cases where the ADA4830-1 and ADA4830-2
drive transmission lines, series terminate the outputs and use
controlled impedance traces of the shortest length possible to
connect to the signal I/O pins, which should not pass over any
voids in the ground plane.
EXPOSED PADDLE (EPAD) CONNECTION
The ADA4830-1 and ADA4830-2 have an exposed thermal pad
(EPAD) on the bottom of the package. This pad is not electrically
connected to the die and can be left floating or connected to the
ground plane. Should heat dissipation be a concern, thermal
resistance can be minimized by soldering the EPAD to a
metalized pad on the PCB. Connect this pad to the ground
plane with multiple vias. Note that the thermal resistance (θJA)
of the device is specified with the EPAD soldered to the PCB.
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