參數(shù)資料
型號(hào): AD9216BCPZRL7-65
廠商: Analog Devices Inc
文件頁(yè)數(shù): 31/40頁(yè)
文件大小: 0K
描述: IC ADC 10BIT DUAL 65MSPS 64LFCSP
標(biāo)準(zhǔn)包裝: 750
位數(shù): 10
采樣率(每秒): 65M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
功率耗散(最大): 240mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤(pán),CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 4 個(gè)單端,單極;2 個(gè)差分,單極
AD9216
Rev. A | Page 37 of 40
THERMAL CONSIDERATIONS
The AD9216 LFCSP package has an integrated heat slug that
improves the thermal and electrical properties of the package
when locally attached to a ground plane at the PCB. A thermal
(filled) via array to a ground plane beneath the part provides
a path for heat to escape the package, lowering junction
temperature. Improved electrical performance also results
from the reduction in package parasitics due to proximity
of the ground plane. Recommended array is 0.3 mm vias
on 1.2 mm pitch. θJA = 26.4°C/W with this recommended
configuration. Soldering the slug to the PCB is a require-
ment for this package.
04775-047
Figure 60. Thermal Via Array
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AD9216BCPZRL7-80 功能描述:IC ADC 10BIT DUAL 80MSPS 64LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):12 采樣率(每秒):300k 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散(最大):75mW 電壓電源:單電源 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:24-SOIC 包裝:帶卷 (TR) 輸入數(shù)目和類型:1 個(gè)單端,單極;1 個(gè)單端,雙極
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