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參數(shù)資料
| 型號： | AD7392 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Parallel Input Micropower 10- and 12-Bit DACs(并行輸入微功耗12位D/A轉(zhuǎn)換器) |
| 中文描述： | 并行輸入微10 -和12位DAC（并行輸入微功耗12位的D / A轉(zhuǎn)換器） |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 331K |
| 代理商： | AD7392 |
AD7392/AD7393
–4–
REV. 0
PIN CONFIGURATIONS
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD7392
V
REF
V
OUT
AGND
DGND
D11
D10
D9
D8
D7
D6
V
DD
SHDN
CS
RS
D0
D1
D2
D3
D4
D5
NC = NO CONNECT
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD7393
V
REF
V
OUT
AGND
DGND
D9
D8
D7
D6
D5
D4
V
DD
SHDN
CS
RS
NC
NC
D0
D1
D2
D3
NC = NO CONNECT
PIN DESCRIPTION
Function
#
Name
1
V
DD
Positive Power Supply Input. Specified range
of operation +2.7 V to +5.5 V.
Power Shutdown active low input. DAC regis-
ter contents are saved as long as power stays on
the V
DD
pin. When
SHDN
= 0,
CS
strobes will
write new data into the DAC register.
Chip Select latch enable, active low.
Resets DAC register to zero condition. Asyn-
chronous active low input.
No connect Pins 5 and 6 on the AD7393.
Digital Ground.
Analog Ground.
DAC Voltage Output.
DAC Reference Input Pin. Establishes DAC
full-scale voltage.
D0–D11 12 parallel input data bits. D11 = MSB Pin 16,
D0 = LSB Pin 5, AD7392.
D0–D9
10 parallel input data bits. D9 = MSB. Pin 16,
D0 = LSB Pin 7, AD7393.
2
SHDN
3
4
CS
RS
5, 6 NC
17
18
19
20
DGND
AGND
V
OUT
V
REFIN
ORDERING GUIDE
Res
(LSB)
Package
Description
Package
Option
Model
Temp
AD7392AN
AD7392AR
AD7393AN
AD7393AR
AD7393ARU 10
12
12
10
10
XIND
XIND
XIND
AUTO
XIND
20-Pin P-DIP
20-Lead SOIC
20-Pin P-DIP
20-Lead SOIC
TSSOP-20
N-20
R-20
N-20
R-20
RU-20
NOTES
XIND = –40
°
C to +85
°
C; AUTO = –40
°
C to +85
°
C.
The AD7392 contains 709 transistors. The die size measures 78 mil
×
85 mil =
6630 sq. mil.
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V, +8 V
V
REF
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . .–0.3 V, +8 V
V
OUT
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
I
OUT
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V, +2 V
Package Power Dissipation . . . . . . . . . . . . . (T
J
max – T
A
)/
θ
JA
Thermal Resistance
θ
JA
20-Pin Plastic DIP Package (N-20) . . . . . . . . . . . . 57
°
C/W
20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . . 60
°
C/W
20-Lead Thin-Shrink Surface Mount (RU-20) . . . 155
°
C/W
Maximum Junction Temperature (T
J
max) . . . . . . . . . . 150
°
C
Operating Temperature Range . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature
N-20 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . .+300
°
C
R-20 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . .+215
°
C
RU-20 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . .+220
°
C
*Stress above those listed under “Absolute Maximum Ratings” may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7392/AD7393 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
CS
DB11–DB0
RS
V
OUT
t
CS
DATA VALID
1
0
0
0
1
1
FS
ZS
t
DS
t
DH
t
RS
±
0.1% FS
ERROR BAND
t
S
t
S
Figure 3. Timing Diagram
DB
X
CS
RS
TO
INTERNAL
DAC
SWITCHES
1 OF 12 LATCHES
OF THE
DAC REGISTER
Figure 4. Digital Control Logic
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| AD7392AN | 功能描述:IC DAC 12BIT PARALLEL 3V 20-DIP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| AD7392ANZ | 功能描述:IC DAC 12BIT PARALLEL 3V 20DIP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
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| AD7392AR-REEL | 制造商:Analog Devices 功能描述:DAC 1-CH R-2R 12-bit 20-Pin SOIC W T/R |
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