- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄8999 > AD5412ACPZ-REEL7 (Analog Devices Inc)IC DAC 12BIT SER 40-LFCSP PDF資料下載
參數(shù)資料
| 型號(hào)： | AD5412ACPZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 32/44頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 12BIT SER 40-LFCSP |
| 設(shè)計(jì)資源： | Simplified 12-Bit Voltage and 4 mA-to-20 mA Output Solution Using AD5412 (CN0097) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 設(shè)置時(shí)間： | 25µs |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | MICROWIRE?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字，雙 ± |
| 功率耗散（最大）： | 128mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 40-VFQFN 裸露焊盤(pán)，CSP |
| 供應(yīng)商設(shè)備封裝： | 40-LFCSP-VQ（6x6） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 輸出數(shù)目和類(lèi)型： | 1 電流，單極；1 電流，雙極；1 電壓，單極；1 電壓，雙極 |
| 采樣率（每秒）： | 40k |
| 產(chǎn)品目錄頁(yè)面： | 782 (CN2011-ZH PDF) |
| 其它名稱(chēng)： | AD5412ACPZ-REEL7DKR |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)當(dāng)前第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)
AD5412/AD5422
Data Sheet
Rev. I | Page 38 of 44
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. Design the printed circuit board (PCB) on
digital sections are separated and confined to certain areas of the
devices require an analog ground-to-digital ground connection,
make the connection at one point only. Establish the star ground
point as close as possible to the device.
10 F in parallel with 0.1 F on each supply located as close to
the package as possible, ideally right up against the device. The
10 F capacitors are the tantalum bead type. The 0.1 F capacitor
should have low effective series resistance (ESR) and low effective
series inductance (ESI), such as the common ceramic types,
which provide a low impedance path to ground at high frequencies
to handle transient currents due to internal logic switching.
large a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks should be shielded with a digital ground
to avoid radiating noise to other parts of the board. Never run these
near the reference inputs. A ground line routed between the SDIN
and SCLK lines helps reduce crosstalk between them (this is not
required on a multilayer board that has a separate ground plane,
but separating the lines helps). It is essential to minimize noise
on the REFIN line because it couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the PCB should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to the ground plane, and signal
traces are placed on the solder side.
THERMAL AND SUPPLY CONSIDERATIONS
junction temperature of 125°C. It is important that the devices
not be operated under conditions that cause the junction
temperature to exceed this value. Excessive junction tempera-
maximum AVDD while driving the maximum current (24 mA)
directly to ground. In this case, control the ambient temperature
or reduce AVDD. The conditions depend on the device package.
At the maximum ambient temperature of 85°C, the 24-lead TSSOP
package can dissipate 1.14 mW, and the 40-lead LFCSP package
can dissipate 1.21 W.
To ensure that the junction temperature does not exceed 125°C
while driving the maximum current of 24 mA directly into ground
(also adding an on-chip current of 3 mA), reduce AVDD from the
maximum rating to ensure that the package is not required to
dissipate more power than previously stated (see Table 25,
Figure 80, and Figure 81).
0
0.5
1.0
1.5
2.0
2.5
40
45
50
55
60
65
70
75
80
85
AMBIENT TEMPERATURE (°C)
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
LFCSP
TSSOP
06996-
066
Figure 80. Maximum Power Dissipation vs. Ambient Temperature
25
27
29
31
33
35
37
39
41
43
45
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
SU
PPL
Y
VO
L
T
A
G
E
(V)
06996-
067
TSSOP
LFCSP
Figure 81. Maximum Supply Voltage vs. Ambient Temperature
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MS27497E22B2SB | CONN RCPT 85POS WALL MNT W/SCKT |
| M83723/95W1412N | CONN PLUG 12POS STRAIGHT W/SCKT |
| M83723/95R1412N | CONN PLUG 12POS STRAIGHT W/SCKT |
| M83723/96R14126 | CONN PLUG 12POS STRAIGHT W/PINS |
| M83723/95G14046 | CONN PLUG 4POS STRAIGHT W/SCKT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD5412AREZ | 功能描述:IC DAC 12BIT SER 24TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:47 系列:- 設(shè)置時(shí)間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類(lèi)型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD5412AREZ | 制造商:Analog Devices 功能描述:IC DAC 12BIT TSSOP-24 制造商:Analog Devices 功能描述:IC, DAC, 12BIT, TSSOP-24 |
| AD5412AREZ-REEL7 | 功能描述:IC DAC 12BIT SER 24-TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產(chǎn)品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標(biāo)準(zhǔn)包裝:91 系列:- 設(shè)置時(shí)間:4µs 位數(shù):10 數(shù)據(jù)接口:MICROWIRE?，串行，SPI? 轉(zhuǎn)換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類(lèi)型:8 電壓，單極 采樣率（每秒）:* |
| AD5412BCPZ | 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:Single Channel, 12/16-Bit, Serial Input, Current Source & Voltage Output DAC |
| AD5412BREZ | 制造商:Analog Devices 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。