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參數(shù)資料
| 型號(hào)： | ACPM-7881-TR1 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 4 X 4 MM, 1.10 MM HEIGHT, LEAD FREE, SMT, 10 PIN |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大?。?/td> | 221K |
| 代理商： | ACPM-7881-TR1 |
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312
or (408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Inter-
national), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright 2004 Agilent Technologies, Inc.
Novermber 4, 2004
5989-1894EN
Solder Paste Recommendation
The ACPM-7881 package is a
lead free package that was
proven to pass MSL3 when
reflowed under lead free
solder reflow profile. The
recommended lead free solder
for SMT reflow is Sn-Ag-Cu
(95.5% Tin, 3.8% Silver, 0.7%
Copper) or other similar Sn-
Ag-Cu solders. This lead free
solder paste has a melting
point of 218°C (423°F), the
ternary eutectic of Sn-Ag-Cu
system, giving it the advantage
of being the lowest melting
lead free alternative. This
temperature is still low enough
to protect from damaging the
internal circuitry during solder
reflow operations provided the
exposure time at peak reflow
temperatures is not too
excessive.
In certain situations, the
designer may use leaded solder
paste for reflow. The
recommended solder for
mounting ACPM-7881 package
is Sn63 (63% Sn, 37% Pb). It is
a eutectic compound with a
typical melting point of 183°C.
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