參數(shù)資料
型號(hào)： ACPM-7881-TR1
廠商： AGILENT TECHNOLOGIES INC
元件分類(lèi)： 放大器
英文描述： 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝： 4 X 4 MM, 1.10 MM HEIGHT, LEAD FREE, SMT, 10 PIN
文件頁(yè)數(shù)： 2/12頁(yè)
文件大?。?/td> 221K
代理商： ACPM-7881-TR1
10
Lead Free Reflow Profile General
Guidelines
i. Ramp 1
Ramp to 100°C. Maximum
slope for this zone is limited
to 2°C/sec. Faster heating with
ramp higher than 2°C may
result in excessive solder
balling and slump.
ii. Preheat
Preheat setting should range
from 100 to 150°C over a
period of 60 to 120 seconds
depending on the
characteristics of the PCB
components and the thermal
characteristics of the oven. If
possible, do not prolong
preheat as it will cause
excessive oxidation to occur to
the solder powder surface.
iii. Ramp 2
The time in this zone should
be kept below 35 seconds to
reduce the risk of flux
exhaustion. The ramp up rate
should be 2°C/sec from 150°C
to re-flow at 217°C. It is
important that the flux
medium retains its activity
during this phase to ensure
the complete coalescence of
the solder particles during re-
flow.
iv. Reflow
The peak reflow temperature is
calculated by adding ~32°C to
the melting point of the alloy.
Lead free solder paste melts at
218°C and peak reflow
temperature is 218°C + 32°C
= 250°C (±5°C). Note that total
time over 218°C is critical and
should typically be 60 – 150
seconds. This period
determines the appearance of
the solder joints. Excessive
time above reflow may cause a
dull finish and charred of flux
residues. Insufficient time
above reflow may lead to poor
wetting and improperly fused
(cloudy) flux residues.
v. Cooling
Maximum slope for cooling is
limited to 3°C/sec. More
rapid cooling may cause solder
joints crack while cooling at a
slower rate will increase the
likelihood of a crystalline
appearance on the solder
joints (dull finish).
Solder Reflow Profile
The most commonly used
solder reflow method is
accomplished in a belt furnace
using convection heat transfer.
This profile is designed to
ensure reliable finished joints.
However, the profile indicated
will vary among different
solder pastes from different
manufacturers and is shown
here for reference only.
Other factors that can affect
the profile include the density
and types of components on
the board, type of solder used
and type of board or substrate
material being used. The
profile shows the actual
temperature that should occur
on the surface of a test board
at or near the central of the
solder joint. For this type of
reflow soldering, the circuit
board and solder joints are
first to get heated up. The
components on the board are
then heated by conduction.
The circuit board, because it
has a large surface area,
absorbs thermal energy
efficiently and distributes this
heat to the components.
Reflow temperature profiles
designed for tin/lead alloys
will need to be revised
accordingly to cater for the
melting point of the lead free
solder being 34°C (54°F)
higher than that of tin/lead
eutectic or near-eutectic alloys.
In addition, the surface
tension of molten lead free
solder alloys is significantly
higher than the surface tension
for tin/lead alloys and this can
reduce the spread of lead free
solder during reflow.
250
200
150
100
Melting point = 218C
Suggested Lead Free Reflow Profile For SnAgCu Solder Paste
0
50
100
150
200
250
Seconds
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
50
Peak = 250 ± 5C
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